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37. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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38. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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39. 
Cover image for Basic Electronic Circuits Problems and Solutions
Basic Electronic Circuits Problems and Solutions
Author 
Vasudevan, K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09363-0
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40. 
Cover image for Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Author 
Triwiyanto, Triwiyanto. editor. Rizal, Achmad. editor. Caesarendra, Wahyu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0248-4
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41. 
Cover image for Springer Handbook of Semiconductor Devices
Springer Handbook of Semiconductor Devices
Author 
Rudan, Massimo. editor. Brunetti, Rossella. editor. Reggiani, Susanna. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-79827-7
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42. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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43. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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44. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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45. 
Cover image for Recent Advances in Metrology Select Proceedings of AdMet 2021
Recent Advances in Metrology Select Proceedings of AdMet 2021
Author 
Yadav, Sanjay. editor. Chaudhary, K.P. editor. Gahlot, Ajay. editor. Arya, Yogendra. editor. Dahiya, Aman. editor.
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https://doi.org/10.1007/978-981-19-2468-2
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46. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11224-9
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47. 
Cover image for Understanding Error Control Coding
Understanding Error Control Coding
Author 
Sanvicente, Emilio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-05840-1
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48. 
Cover image for Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems MCCS 2018
Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems MCCS 2018
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-7091-5
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