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1. 
Cover image for Fully-Integrated Low-Dropout Regulators
Fully-Integrated Low-Dropout Regulators
Author 
Mao, Xiangyu. author. (orcid)0000-0001-6530-8311 Lu, Yan. author. Martins, Rui P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-84916-9
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Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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Cover image for A Problem-Solving Approach to Electric Circuits Volume III
A Problem-Solving Approach to Electric Circuits Volume III
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-95493-1
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Cover image for Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Author 
Arif, Tariq M., author. John Wiley & Sons, publisher.
Preferred Shelf Number 
Q325.73 .A75 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394269297
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5. 
Cover image for Next-generation electrochromic devices : from multifunctional materials to smart glasses
Next-generation electrochromic devices : from multifunctional materials to smart glasses
Author 
Cossari, Pierluigi, author.
Preferred Shelf Number 
TA1750 .C67 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527832583
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6. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
Preferred Shelf Number 
TK7874
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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7. 
Cover image for Silicon Components and Processes Self Study Field-Effect Transistors
Silicon Components and Processes Self Study Field-Effect Transistors
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59193-8
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8. 
Cover image for Embedded Machine Learning with Microcontrollers Applications on Arduino Boards
Embedded Machine Learning with Microcontrollers Applications on Arduino Boards
Author 
Ünsalan, Cem. author. (orcid)0000-0002-8904-3730 Höke, Berkan. author. (orcid)0000-0001-5682-500X Atmaca, Eren. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-69421-9
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9. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
Author 
Veendrick, Harry. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-64249-4
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10. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume V
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume V
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-96-1391-5
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11. 
Cover image for Lecture Notes in Analog Electronics Testing and Diagnosis of Analog and Mixed-Signal Electronic Circuits
Lecture Notes in Analog Electronics Testing and Diagnosis of Analog and Mixed-Signal Electronic Circuits
Author 
Litovski, Vančo B. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8257-4
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12. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume III
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-1383-0
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