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37. 
Cover image for Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 2
Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 2
Author 
Dao, Nhu-Ngoc. editor. Thinh, Tran Ngoc. editor. Nguyen, Ngoc Thanh. editor. (orcid)0000-0002-3247-2948 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-46749-3
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38. 
Cover image for ITNG 2023 20th International Conference on Information Technology-New Generations
ITNG 2023 20th International Conference on Information Technology-New Generations
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Latifi, Shahram. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-28332-1
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39. 
Cover image for Proceedings of the International Conference on Internet of Things, Communication and Intelligent Technology
Proceedings of the International Conference on Internet of Things, Communication and Intelligent Technology
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Dong, Jian. editor. Zhang, Long. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0416-7
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40. 
Cover image for Integration of Unmanned Aerial Vehicles in Wireless Communication and Networks UAVs and 5G
Integration of Unmanned Aerial Vehicles in Wireless Communication and Networks UAVs and 5G
Author 
Jayakody, Dushantha Nalin K. editor. Muthuchidambaranathan, P. editor. Dinis, Rui. editor. Panic, Stefan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-03880-8
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41. 
Cover image for Implementing Cloud Robotics for Practical Applications From Human-Robot Interaction to Autonomous Navigation
Implementing Cloud Robotics for Practical Applications From Human-Robot Interaction to Autonomous Navigation
Author 
Mello, Ricardo C. author. Ribeiro, Moises R. N. author. Frizera-Neto, Anselmo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-16908-3
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42. 
Cover image for Advances in System-Integrated Intelligence Proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), September 7-9, 2022, Genova, Italy
Advances in System-Integrated Intelligence Proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), September 7-9, 2022, Genova, Italy
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Valle, Maurizio. editor. Lehmhus, Dirk. editor. Gianoglio, Christian. editor. Ragusa, Edoardo. editor. Seminara, Lucia. editor.
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https://doi.org/10.1007/978-3-031-16281-7
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43. 
Cover image for Distributed Fault-Tolerant Consensus Control of Leader-Following Systems Based on Adaptive Control Approach
Distributed Fault-Tolerant Consensus Control of Leader-Following Systems Based on Adaptive Control Approach
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Shen, Qikun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-7426-9
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44. 
Cover image for AI Embedded Assurance for Cyber Systems
AI Embedded Assurance for Cyber Systems
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Wang, Cliff. editor. Iyengar, S.S. editor. Sun, Kun. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-42637-7
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45. 
Cover image for Key Technologies of Internet of Things and Smart Grid
Key Technologies of Internet of Things and Smart Grid
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Zeng, Xianwu. author. Bao, Shuping. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-7603-4
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46. 
Cover image for ICT Analysis and Applications Proceedings of ICT4SD 2023, Volume 2
ICT Analysis and Applications Proceedings of ICT4SD 2023, Volume 2
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Fong, Simon. editor. Dey, Nilanjan. editor. Joshi, Amit. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-6568-7
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47. 
Cover image for Enterprise Interoperability IX Interoperability in the Era of Artificial Intelligence
Enterprise Interoperability IX Interoperability in the Era of Artificial Intelligence
Author 
Archimède, Bernard. editor. Ducq, Yves. editor. Young, Bob. editor. Karray, Hedi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-90387-9
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48. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
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Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-93627-3
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