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37. 
Cover image for Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Electromigration Inside Logic Cells Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS
Author 
Posser, Gracieli. author. Sapatnekar, Sachin S. author. Reis, Ricardo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-48899-8
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38. 
Cover image for Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability
Author 
Hu, Kai. author. Chakrabarty, Krishnendu. author. Ho, Tsung-Yi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-56255-1
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39. 
Cover image for Embedded Systems Design with Special Arithmetic and Number Systems
Embedded Systems Design with Special Arithmetic and Number Systems
Author 
Molahosseini, Amir Sabbagh. editor. de Sousa, Leonel Seabra. editor. (orcid)0000-0002-8066-221X Chang, Chip-Hong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-49742-6
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40. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52548-8
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41. 
Cover image for Parallel Sparse Direct Solver for Integrated Circuit Simulation
Parallel Sparse Direct Solver for Integrated Circuit Simulation
Author 
Chen, Xiaoming. author. Wang, Yu. author. Yang, Huazhong. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-53429-9
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42. 
Cover image for Hardware Protection through Obfuscation
Hardware Protection through Obfuscation
Author 
Forte, Domenic. editor. Bhunia, Swarup. editor. Tehranipoor, Mark M. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-49019-9
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43. 
Cover image for Carbon Nanotubes for Interconnects Process, Design and Applications
Carbon Nanotubes for Interconnects Process, Design and Applications
Author 
Todri-Sanial, Aida. editor. Dijon, Jean. editor. Maffucci, Antonio. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29746-0
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44. 
Cover image for Hardware IP Security and Trust
Hardware IP Security and Trust
Author 
Mishra, Prabhat. editor. Bhunia, Swarup. editor. Tehranipoor, Mark. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-49025-0
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45. 
Cover image for Fundamentals of IP and SoC Security Design, Verification, and Debug
Fundamentals of IP and SoC Security Design, Verification, and Debug
Author 
Bhunia, Swarup. editor. Ray, Sandip. editor. Sur-Kolay, Susmita. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50057-7
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46. 
Cover image for Emerging Technology and Architecture for Big-data Analytics
Emerging Technology and Architecture for Big-data Analytics
Author 
Chattopadhyay, Anupam. editor. (orcid)0000-0002-8818-6983 Chang, Chip Hong. editor. Yu, Hao. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-54840-1
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47. 
Cover image for Automatic Analog IC Sizing and Optimization Constrained with PVT Corners and Layout Effects
Automatic Analog IC Sizing and Optimization Constrained with PVT Corners and Layout Effects
Author 
Lourenço, Nuno. author. Martins, Ricardo. author. (orcid)0000-0002-8251-1415 Horta, Nuno. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-42037-0
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48. 
Cover image for Formal Verification of Simulink/Stateflow Diagrams A Deductive Approach
Formal Verification of Simulink/Stateflow Diagrams A Deductive Approach
Author 
Zhan, Naijun. author. Wang, Shuling. author. (orcid)0000-0002-2798-2660 Zhao, Hengjun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-47016-0
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