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37. 
Cover image for Reliability and failure of electronic materials and devices
Reliability and failure of electronic materials and devices
Author 
Ohring, Milton, 1936- Kasprzak, Lucian.
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ONLINE(355485.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780120885749
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38. 
Cover image for Theory of Charge Transport in Carbon Electronic Materials
Theory of Charge Transport in Carbon Electronic Materials
Author 
Shuai, Zhigang. author. Wang, Linjun. author. Song, Chenchen. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-25076-7
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39. 
Cover image for Iontronics ionic carriers in organic electronic materials and devices
Iontronics ionic carriers in organic electronic materials and devices
Author 
Leger, Janelle. Berggren, Magnus. Carter, Sue A., 1966-
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Distributed by publisher. Purchase or institutional license may be required for access.
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40. 
Cover image for Advanced calculations for defects in materials : electronic structure methods
Advanced calculations for defects in materials : electronic structure methods
Author 
Alkauskas, Audrius.
Preferred Shelf Number 
TA410 A379 2011
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41. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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42. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02417-7
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43. 
Cover image for Electrical characterization of organic electronic materials and devices
Electrical characterization of organic electronic materials and devices
Author 
Stallinga, Peter, 1966- Wiley InterScience (Online service)
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ONLINE
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John Wiley http://dx.doi.org/10.1002/9780470750162
http://site.ebrary.com/lib/alltitles/Doc?id=10342813
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44. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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45. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-48433-4
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46. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72132-1
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47. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
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48. 
Cover image for Advances in dielectric materials and electronic devices proceedings of the 107th Annual Meeting of the American Ceramic Society : Baltimore, Marylans, USA (2005)
Advances in dielectric materials and electronic devices proceedings of the 107th Annual Meeting of the American Ceramic Society : Baltimore, Marylans, USA (2005)
Author 
Nair, K. M. American Ceramic Society. Meeting (107th : 2005 : Baltimore, Md.) Wiley InterScience (Online service) International Symposium on Advanced Dielectric Materials: Design, Preparation, Processing, Properties and Applications (2005 : Baltimore, Md.)
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