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1. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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2. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
Author 
Yu, Peter Y. author. Cardona, Manuel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-00710-1
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3. 
Cover image for Solid-State Physics Introduction to the Theory
Solid-State Physics Introduction to the Theory
Author 
Patterson, James. author. Bailey, Bernard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02589-1
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4. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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5. 
Cover image for Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Author 
Fortin, Jeffrey. editor. Zribi, Anis. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138612
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6. 
Cover image for Copper Interconnect Technology
Copper Interconnect Technology
Author 
Gupta, Tapan. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0076-0
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7. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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8. 
Cover image for Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Author 
Seebauer, Edmund G. author. Kratzer, Meredith C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-059-3
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9. 
Cover image for Low Pressure Plasmas and Microstructuring Technology
Low Pressure Plasmas and Microstructuring Technology
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Franz, Gerhard. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-85849-2
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10. 
Cover image for Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
Into the Nano Era Moore’s Law Beyond Planar Silicon CMOS
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Huff, Howard R. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-74559-4
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11. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
Author 
Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74363-9
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12. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78219-5
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