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37. 
Cover image for Self-Consistent Methods for Composites Vol. 2: Wave Propagation in Heterogeneous Materials
Self-Consistent Methods for Composites Vol. 2: Wave Propagation in Heterogeneous Materials
Author 
Kanaun, S. K. author. Levin, V. M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6968-0
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38. 
Cover image for Multiscale Fatigue Crack Initiation and Propagation of Engineering Materials: Structural Integrity and Microstructural Worthiness Fatigue Crack Growth Behaviour of Small and Large Bodies
Multiscale Fatigue Crack Initiation and Propagation of Engineering Materials: Structural Integrity and Microstructural Worthiness Fatigue Crack Growth Behaviour of Small and Large Bodies
Author 
Sih, G. C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8520-8
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39. 
Cover image for Integral Foam Molding of Light Metals Technology, Foam Physics and Foam Simulation
Integral Foam Molding of Light Metals Technology, Foam Physics and Foam Simulation
Author 
Koerner, Carolin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-68839-6
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40. 
Cover image for Organic Nanostructures for Next Generation Devices
Organic Nanostructures for Next Generation Devices
Author 
Al-Shamery, Katharina. editor. Rubahn, Horst-Günter. editor. Sitter, Helmut. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-71923-6
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41. 
Cover image for Dilute III-V Nitride Semiconductors and Material Systems Physics and Technology
Dilute III-V Nitride Semiconductors and Material Systems Physics and Technology
Author 
Erol, Ayşe. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-74529-7
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42. 
Cover image for Organic Semiconductors in Sensor Applications
Organic Semiconductors in Sensor Applications
Author 
Bernards, Daniel A. editor. Malliaras, George G. editor. Owens, Róisín M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-76314-7
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43. 
Cover image for Evolution of Thin Film Morphology Modeling and Simulations
Evolution of Thin Film Morphology Modeling and Simulations
Author 
Pelliccione, Matthew. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-75109-2
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44. 
Cover image for Silver Metallization Stability and Reliability
Silver Metallization Stability and Reliability
Author 
Adams, Daniel. author. Alford, Terry L. author. Mayer, James W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84800-027-8
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45. 
Cover image for Microbiologically Influenced Corrosion An Engineering Insight
Microbiologically Influenced Corrosion An Engineering Insight
Author 
Javaherdashti, Reza. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84800-074-2
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46. 
Cover image for Nano- and Micromaterials
Nano- and Micromaterials
Author 
Ohno, Kaoru. editor. Tanaka, Masatoshi. editor. Takeda, Jun. editor. Kawazoe, Yoshiyuki. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-74557-0
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47. 
Cover image for Modelling of Powder Die Compaction
Modelling of Powder Die Compaction
Author 
Brewin, P. R. editor. Coube, O. editor. Doremus, P. editor. Tweed, J. H. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-099-3
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48. 
Cover image for Modeling of Metal Forming and Machining Processes by Finite Element and Soft Computing Methods
Modeling of Metal Forming and Machining Processes by Finite Element and Soft Computing Methods
Author 
Dixit, Prakash M. author. Dixit, Uday S. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84800-189-3
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