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1. 
Cover image for Progress in Engineering Technology VI
Progress in Engineering Technology VI
Author 
Razak, Tajul Adli Abdul. editor. Ismail, Ahmad Kamal. editor. Öchsner, Andreas. editor. (orcid)0000-0002-8844-3206 SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-81517-1
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2. 
Cover image for Foundations of crystallography with computer applications
Foundations of crystallography with computer applications
Author 
Julian, Maureen M., author.
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QD906.7 .E4
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003360209
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for An introduction to fundamentals of diffusion in solid state materials
An introduction to fundamentals of diffusion in solid state materials
Author 
Ghomashchi, Reza, author.
Preferred Shelf Number 
QC176.8 .D5
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003467250
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Cover image for More Adventures in Contemporary Electromagnetic Theory
More Adventures in Contemporary Electromagnetic Theory
Author 
Chiadini, Francesco. editor. (orcid)0000-0002-9339-8622 Fiumara, Vincenzo. editor. (orcid)0000-0003-3644-217X SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-83131-7
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5. 
Cover image for CMOS Plasma and Process Damage
CMOS Plasma and Process Damage
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Prall, Kirk. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-89029-1
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6. 
Cover image for Halide perovskite semiconductors : structures, characterization, properties, and phenomena
Halide perovskite semiconductors : structures, characterization, properties, and phenomena
Author 
Zhou, Yuanyuan, editor. Mora-Sero, Ivan, editor.
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TK7871.85
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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527829026
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7. 
Cover image for Silicon Components and Processes Self Study Unit Processes and Process Integration
Silicon Components and Processes Self Study Unit Processes and Process Integration
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-59219-5
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8. 
Cover image for Silicon Components and Processes Self Study Rectifying and Ohmic Contacts, Bipolar Junction Transistors
Silicon Components and Processes Self Study Rectifying and Ohmic Contacts, Bipolar Junction Transistors
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-59189-1
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9. 
Cover image for X-ray Photon Processing Detectors Space, Industrial, and Medical applications
X-ray Photon Processing Detectors Space, Industrial, and Medical applications
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Hansson, Conny. editor. Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-35241-6
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10. 
Cover image for Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
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Ciofi, Carmine. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-48711-8
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11. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2140-5
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12. 
Cover image for Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Author 
van Driel, Willem Dirk. editor. Pressel, Klaus. editor. Soyturk, Mujdat. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-59361-1
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