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37. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
Format: 
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38. 
Cover image for Natural materials for food packaging application
Natural materials for food packaging application
Author 
Parameswaranpillai, Jyotishkumar, editor.
Preferred Shelf Number 
TP374 .N38 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527837304
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39. 
Cover image for Electronic packaging science and technology
Electronic packaging science and technology
Author 
Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.
Preferred Shelf Number 
TK7870.15 .T85 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
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40. 
Cover image for Nanotechnology in intelligent food packaging
Nanotechnology in intelligent food packaging
Author 
Annu, editor. Bhattacharya, Tanima, editor. Ahmed, Shakeel, editor.
Preferred Shelf Number 
TP374 .N36 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119819011
Format: 
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41. 
Cover image for Food packaging : advanced materials, technologies, and innovations
Food packaging : advanced materials, technologies, and innovations
Author 
Rangappa, Sanjay Mavinkere, editor. Parameswaranpillai, Jyotishkumar, editor. Thiagamani, Senthil Muthu Kumar, editor. Krishnasamy, Senthilkumar, editor. Siengchin, Suchart, editor.
Preferred Shelf Number 
TP374 .F6532 2021
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429322129
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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42. 
Cover image for ACTIVE PACKAGING FOR VARIOUS FOOD APPLICATIONS
ACTIVE PACKAGING FOR VARIOUS FOOD APPLICATIONS
Author 
Selvamuthukumaran, M., editor.
Preferred Shelf Number 
TP374
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003127789
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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43. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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44. 
Cover image for Composites materials for food packaging
Composites materials for food packaging
Author 
Cirillo, Giuseppe, 1980- editor. Kozlowski, Marek A., 1945- editor. Spizzirri, Umile Gianfranco, editor.
Preferred Shelf Number 
TP374 .C66 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119160243
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45. 
Cover image for Packaging for nonthermal processing of food
Packaging for nonthermal processing of food
Author 
Pascall, Melvin, 1954- editor. Han, Jung H., editor.
Preferred Shelf Number 
TP374 .P328 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119126881
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46. 
Cover image for Packaging yourself : the targeted resume
Packaging yourself : the targeted resume
Author 
Wendleton, Kate, author. Five O'Clock Club (New York, N.Y.), issuing body.
Preferred Shelf Number 
ONLINE(341070.1)
Electronic Access 
Available for Hacettepe University via Gale Virtual Reference Library. Click here to access
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47. 
Cover image for Packaging technology fundamentals, materials and processes
Packaging technology fundamentals, materials and processes
Author 
Emblem, Anne. Emblem, Henry.
Preferred Shelf Number 
ONLINE(313043.1)
Electronic Access 
Knovel http://app.knovel.com/hotlink/toc/id:kpPTFMP001/packaging-technology
Knovel http://app.knovel.com/web/toc.v/cid:kpPTFMP001
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48. 
Cover image for Modified atmosphere and active packaging technologies
Modified atmosphere and active packaging technologies
Author 
Arvanitoyannis, Ioannis.
Preferred Shelf Number 
TP374 .M59 2012
Electronic Access 
Click here to view.
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