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37. 
Cover image for Transaction Level Modeling with SystemC TLM Concepts and Applications for Embedded Systems
Transaction Level Modeling with SystemC TLM Concepts and Applications for Embedded Systems
Author 
Ghenassia, Frank. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137175
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38. 
Cover image for Statistical Analysis and Optimization for VLSI: Timing and Power
Statistical Analysis and Optimization for VLSI: Timing and Power
Author 
Srivastava, Ashish. author. Sylvester, Dennis. author. Blaauw, David. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b137645
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39. 
Cover image for Data Mining and Diagnosing IC Fails
Data Mining and Diagnosing IC Fails
Author 
Huisman, Leendert M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137446
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40. 
Cover image for Modeling and Simulation for RF System Design
Modeling and Simulation for RF System Design
Author 
Frevert, Ronny. author. Haase, Joachim. author. Jancke, Roland. author. Knöchel, Uwe. author. Schwarz, Peter. author.
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Electronic Access 
http://dx.doi.org/10.1007/0-387-27585-1
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41. 
Cover image for Model and Design of Bipolar and MOS Current-Mode Logic CML, ECL and SCL Digital Circuits
Model and Design of Bipolar and MOS Current-Mode Logic CML, ECL and SCL Digital Circuits
Author 
Alioto, Massimo. author. Palumbo, Gaetano. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/1-4020-2888-1
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42. 
Cover image for System-level Test and Validation of Hardware/Software Systems
System-level Test and Validation of Hardware/Software Systems
Author 
Sonza Reorda, Matteo. editor. Peng, Zebo. editor. Violante, Massimo. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-145-8
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43. 
Cover image for The Quintessential PIC® Microcontroller
The Quintessential PIC® Microcontroller
Author 
Katzen, Sid. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-202-0
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44. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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45. 
Cover image for Mechatronic Systems Fundamentals
Mechatronic Systems Fundamentals
Author 
Isermann, Rolf. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-259-4
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46. 
Cover image for Mikroprozessortechnik und Rechnerstrukturen
Mikroprozessortechnik und Rechnerstrukturen
Author 
Flik, Thomas. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137981
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47. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138004
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48. 
Cover image for Mikroelektronik Halbleiterbauelemente und deren Anwendung in elektronischen Schaltungen
Mikroelektronik Halbleiterbauelemente und deren Anwendung in elektronischen Schaltungen
Author 
Tille, Thomas. author. Schmitt-Landsiedel, Doris. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138008
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