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37. 
Cover image for Spectral, Convolution and Numerical Techniques in Circuit Theory
Spectral, Convolution and Numerical Techniques in Circuit Theory
Author 
Badrieh, Fuad. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-71437-0
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38. 
Cover image for High-Resolution Microwave Imaging
High-Resolution Microwave Imaging
Author 
Yang, Ruliang. author. Li, Haiying. author. Li, Shiqiang. author. Zhang, Ping. author. Tan, Lulu. author.
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https://doi.org/10.1007/978-981-10-7138-6
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39. 
Cover image for Ultra Low Noise CMOS Image Sensors
Ultra Low Noise CMOS Image Sensors
Author 
Boukhayma, Assim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-68774-2
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40. 
Cover image for Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Author 
Papa, Umberto. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-73174-2
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41. 
Cover image for Advanced Techniques for Power, Energy, and Thermal Management for Clustered Manycores
Advanced Techniques for Power, Energy, and Thermal Management for Clustered Manycores
Author 
Pagani, Santiago. author. Chen, Jian-Jia. author. Shafique, Muhammad. author. Henkel, Jörg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77479-4
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42. 
Cover image for Innovative Design, Manufacturing and Testing of Small Satellites
Innovative Design, Manufacturing and Testing of Small Satellites
Author 
Madry, Scott. author. Martinez, Peter. author. Laufer, Rene. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75094-1
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43. 
Cover image for Getting Started with Tiva ARM Cortex M4 Microcontrollers A Lab Manual for Tiva LaunchPad Evaluation Kit
Getting Started with Tiva ARM Cortex M4 Microcontrollers A Lab Manual for Tiva LaunchPad Evaluation Kit
Author 
Gadre, Dhananjay V. author. Gupta, Sarthak. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-3766-2
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44. 
Cover image for Automated Validation & Verification of UML/OCL Models Using Satisfiability Solvers
Automated Validation & Verification of UML/OCL Models Using Satisfiability Solvers
Author 
Przigoda, Nils. author. Wille, Robert. author. Przigoda, Judith. author. Drechsler, Rolf. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-72814-8
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45. 
Cover image for Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Author 
Anguera, Jaume. editor. Satapathy, Suresh Chandra. editor. Bhateja, Vikrant. editor. Sunitha, K.V.N. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-7329-8
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46. 
Cover image for 3D TCAD Simulation for CMOS Nanoeletronic Devices
3D TCAD Simulation for CMOS Nanoeletronic Devices
Author 
Wu, Yung-Chun. author. Jhan, Yi-Ruei. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-3066-6
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47. 
Cover image for MEMS Lorentz Force Magnetometers From Specifications to Product
MEMS Lorentz Force Magnetometers From Specifications to Product
Author 
Buffa, Cesare. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-59412-5
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48. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author 
Cheng, Jie. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6165-3
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