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37. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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38. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06764-3
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39. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-06773-5
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40. 
Cover image for Intelligent Environmental Sensing
Intelligent Environmental Sensing
Author 
Leung, Henry. editor. Chandra Mukhopadhyay, Subhas. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-12892-4
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