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37. 
Cover image for Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Author 
Ueda, Osamu. editor. Pearton, Stephen J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331478.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4337-7
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38. 
Cover image for High Permittivity Gate Dielectric Materials
High Permittivity Gate Dielectric Materials
Author 
Kar, Samares. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334228.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36535-5
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39. 
Cover image for Magnetic Resonance Imaging with Nonlinear Gradient Fields Signal Encoding and Image Reconstruction
Magnetic Resonance Imaging with Nonlinear Gradient Fields Signal Encoding and Image Reconstruction
Author 
Schultz, Gerrit. author. SpringerLink (Online service)
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ONLINE(335259.1)
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http://dx.doi.org/10.1007/978-3-658-01134-5
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40. 
Cover image for Chips 2020 A Guide to the Future of Nanoelectronics
Chips 2020 A Guide to the Future of Nanoelectronics
Author 
Hoefflinger, Bernd. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-23096-7
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41. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-27512-8
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42. 
Cover image for Adiabatic Logic Future Trend and System Level Perspective
Adiabatic Logic Future Trend and System Level Perspective
Author 
Teichmann, Philip. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-2345-0
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43. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Author 
Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-47318-5
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44. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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45. 
Cover image for Coronal Mass Ejections An Introduction
Coronal Mass Ejections An Introduction
Author 
Howard, Timothy. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8789-1
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46. 
Cover image for Electronique et optoélectronique organiques
Electronique et optoélectronique organiques
Author 
Moliton, André. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-2-8178-0103-2
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47. 
Cover image for Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Author 
Pardo, Lorena. author. Ricote, Jesús. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-2875-4
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48. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-20032-8
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