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37. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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38. 
Cover image for Analog-Digital Converters for Industrial Applications Including an Introduction to Digital-Analog Converters
Analog-Digital Converters for Industrial Applications Including an Introduction to Digital-Analog Converters
Author 
Ohnhäuser, Frank. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47020-6
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39. 
Cover image for Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Author 
Jin, Helena. editor. Sciammarella, Cesar. editor. Yoshida, Sanichiro. editor. Lamberti, Luciano. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06986-9
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