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1. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
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Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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Cover image for Constrained Deformation of Materials Devices, Heterogeneous Structures and Thermo-Mechanical Modeling
Constrained Deformation of Materials Devices, Heterogeneous Structures and Thermo-Mechanical Modeling
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Shen, Y.-L. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6312-3
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3. 
Cover image for Solid State Theory An Introduction
Solid State Theory An Introduction
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Rössler, Ulrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-92762-4
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4. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
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Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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5. 
Cover image for Nanomaterials for Solid State Hydrogen Storage
Nanomaterials for Solid State Hydrogen Storage
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Varin, Robert A. author. Czujko, Tomasz. author. Wronski, Zbigniew S. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-77712-2
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6. 
Cover image for IUTAM Symposium on Mechanical Properties of Cellular Materials Proceedings of the IUTAM Symposium on Mechanical Properties of Cellular Materials, held September 17–20, 2007, LMT-Cachan, Cachan, France
IUTAM Symposium on Mechanical Properties of Cellular Materials Proceedings of the IUTAM Symposium on Mechanical Properties of Cellular Materials, held September 17–20, 2007, LMT-Cachan, Cachan, France
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Zhao, Han. editor. Fleck, N. A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9404-0
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7. 
Cover image for Self-Consistent Methods for Composites Vol. 2: Wave Propagation in Heterogeneous Materials
Self-Consistent Methods for Composites Vol. 2: Wave Propagation in Heterogeneous Materials
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Kanaun, S. K. author. Levin, V. M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6968-0
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8. 
Cover image for Structures Under Crash and Impact Continuum Mechanics, Discretization and Experimental Characterization
Structures Under Crash and Impact Continuum Mechanics, Discretization and Experimental Characterization
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Hiermaier, Stefan Josef. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-73863-5
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9. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
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Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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10. 
Cover image for Self-Consistent Methods for Composites Vol.1: Static Problems
Self-Consistent Methods for Composites Vol.1: Static Problems
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Kanaun, S. K. author. Levin, V. M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6664-1
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11. 
Cover image for Narrow Gap Semiconductors 2007 Proceedings of the 13th International Conference, 8–12 July, 2007, Guildford, UK
Narrow Gap Semiconductors 2007 Proceedings of the 13th International Conference, 8–12 July, 2007, Guildford, UK
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Murdin, Ben. editor. Clowes, Steve. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8425-6
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12. 
Cover image for Anwendungstechnologie Aluminum
Anwendungstechnologie Aluminum
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Ostermann, Friedrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-69451-9
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