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37. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Author 
Iwamoto, Nancy. editor. Yuen, Matthew M.F. editor. Fan, Haibo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1728-6
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38. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1812-2
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39. 
Cover image for Handbook of Visual Display Technology
Handbook of Visual Display Technology
Author 
Chen, Janglin. editor. Cranton, Wayne. editor. Fihn, Mark. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-79567-4
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40. 
Cover image for Electroactivity in Polymeric Materials
Electroactivity in Polymeric Materials
Author 
Rasmussen, Lenore. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0878-9
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41. 
Cover image for Nanostructured Materials and Their Applications
Nanostructured Materials and Their Applications
Author 
Logothetidis, Stergios. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-22227-6
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42. 
Cover image for GaN and ZnO-based Materials and Devices
GaN and ZnO-based Materials and Devices
Author 
Pearton, Stephen. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-23521-4
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43. 
Cover image for Chalcogenides Metastability and Phase Change Phenomena
Chalcogenides Metastability and Phase Change Phenomena
Author 
Kolobov, Alexander V. author. Tominaga, Junji. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28705-3
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44. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34237-0
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45. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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46. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-236-0
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47. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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48. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1638-9
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