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1. 
Cover image for ICT Infrastructure and Computing Proceedings of ICT4SD 2022
ICT Infrastructure and Computing Proceedings of ICT4SD 2022
Author 
Tuba, Milan. editor. Akashe, Shyam. editor. Joshi, Amit. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-5331-6
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2. 
Cover image for Mobile Radio Communications and 5G Networks Proceedings of Third MRCN 2022
Mobile Radio Communications and 5G Networks Proceedings of Third MRCN 2022
Author 
Marriwala, Nikhil. editor. Tripathi, C.C. editor. Jain, Shruti. editor. Kumar, Dinesh. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-19-7982-8
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3. 
Cover image for Systems-Level Packaging for Millimeter-Wave Transceivers
Systems-Level Packaging for Millimeter-Wave Transceivers
Author 
Božanić, Mladen. author. (orcid)0000-0001-9174-0781 Sinha, Saurabh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-14690-0
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4. 
Cover image for Machine-to-machine communications : architectures, technology, standards, and applications
Machine-to-machine communications : architectures, technology, standards, and applications
Author 
Misic, Vojislav B., editor. of compilation. Misic, Jelena, editor. of compilation.
Preferred Shelf Number 
TK5105.67 .M344 2015
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5. 
Cover image for 5G : 2020 and beyond
5G : 2020 and beyond
Author 
Prasad, Ramjee, author.
Preferred Shelf Number 
TK5103.2
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003336877
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cover image for Unit and ubiquitous internet of things
Unit and ubiquitous internet of things
Author 
Ning, Huansheng., author.
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TK7895 .E43 N46 2013
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