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37. 
Cover image for Multi-Net Optimization of VLSI Interconnect
Multi-Net Optimization of VLSI Interconnect
Author 
Moiseev, Konstantin. author. Kolodny, Avinoam. author. Wimer, Shmuel. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-0821-5
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38. 
Cover image for Low Power Interconnect Design
Low Power Interconnect Design
Author 
Saini, Sandeep. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-1323-3
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39. 
Cover image for Engineering Embedded Systems Physics, Programs, Circuits
Engineering Embedded Systems Physics, Programs, Circuits
Author 
Hintenaus, Peter. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-10680-9
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40. 
Cover image for Multiprocessor Scheduling for Real-Time Systems
Multiprocessor Scheduling for Real-Time Systems
Author 
Baruah, Sanjoy. author. Bertogna, Marko. author. Buttazzo, Giorgio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08696-5
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41. 
Cover image for Out-of-order Parallel Discrete Event Simulation for Electronic System-level Design
Out-of-order Parallel Discrete Event Simulation for Electronic System-level Design
Author 
Chen, Weiwei. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08753-5
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42. 
Cover image for Molecular Computing Origins and Promises
Molecular Computing Origins and Promises
Author 
Rambidi, Nicholas G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-211-99699-7
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43. 
Cover image for Embedded Systems for Smart Appliances and Energy Management
Embedded Systems for Smart Appliances and Energy Management
Author 
Grimm, Christoph. editor. Neumann, Peter. editor. Mahlknecht, Stefan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330846.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8795-2
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44. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
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ONLINE(330852.1)
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http://dx.doi.org/10.1007/978-1-4419-9542-1
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45. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
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ONLINE(331791.1)
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http://dx.doi.org/10.1007/978-1-4614-5508-0
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46. 
Cover image for 3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures
Author 
Zatt, Bruno. author. Shafique, Muhammad. author. Bampi, Sergio. author. Henkel, Jörg. author. SpringerLink (Online service)
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ONLINE(332110.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6759-5
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47. 
Cover image for Handbook of Signal Processing Systems
Handbook of Signal Processing Systems
Author 
Bhattacharyya, Shuvra S. editor. Deprettere, Ed F. editor. Leupers, Rainer. editor. Takala, Jarmo. editor. SpringerLink (Online service)
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ONLINE(332139.1)
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http://dx.doi.org/10.1007/978-1-4614-6859-2
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48. 
Cover image for Supercomputing 28th International Supercomputing Conference, ISC 2013, Leipzig, Germany, June 16-20, 2013. Proceedings
Supercomputing 28th International Supercomputing Conference, ISC 2013, Leipzig, Germany, June 16-20, 2013. Proceedings
Author 
Kunkel, Julian Martin. editor. Ludwig, Thomas. editor. Meuer, Hans Werner. editor. SpringerLink (Online service)
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ONLINE(334662.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-38750-0
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