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37. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
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Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-235-7
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38. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
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Thuselt, Frank. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138004
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