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37. 
Cover image for Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Author 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
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https://doi.org/10.1007/978-981-97-7255-1
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38. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4787-3
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39. 
Cover image for Revealing Hybrid DC-DC Converters
Revealing Hybrid DC-DC Converters
Author 
Huang, Mo. author. (orcid)0000-0003-0497-194X Martins, Rui Paulo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-86350-9
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40. 
Cover image for CMOS-based Portable NMR/MRI Microsystems
CMOS-based Portable NMR/MRI Microsystems
Author 
Fan, Shuhao. author. Zhou, Qi. author. (orcid)0000-0002-3949-7953 Lei, Ka-Meng. author. Martins, Rui P. author. Mak, Pui-In. author.
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https://doi.org/10.1007/978-3-031-91447-8
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41. 
Cover image for Principles of Electrical Measurement and Measuring Instruments
Principles of Electrical Measurement and Measuring Instruments
Author 
Jagadeesh Kumar, V. author. (orcid)0000-0002-2575-5632 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-5475-8
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42. 
Cover image for Analog Microelectronics
Analog Microelectronics
Author 
Borgarino, Mattia. author. (orcid)0000-0001-9678-592X SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-94286-0
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43. 
Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
Author 
Wang, Kaiying. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-95-1606-3
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44. 
Cover image for Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Author 
Bhateja, Vikrant. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7222-6
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45. 
Cover image for Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Author 
Kumar, Pradeep. editor. Navaraj, William. editor. Moreira, Fernando. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-9231-6
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46. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume IV
A Problem-Solving Approach to Electric Circuits Volume IV
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-96586-9
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47. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume I
A Problem-Solving Approach to Electric Circuits Volume I
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95623-2
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48. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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