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49. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-981-19-2308-1
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50. 
Cover image for Signals and Systems A Practical Approach
Signals and Systems A Practical Approach
Author 
Sundararajan, D. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19377-4
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51. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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52. 
Cover image for Embedded Systems Design using the MSP430FR2355 LaunchPad™
Embedded Systems Design using the MSP430FR2355 LaunchPad™
Author 
LaMeres, Brock J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20888-1
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53. 
Cover image for Multi-Gigahertz Nyquist Analog-to-Digital Converters Architecture and Circuit Innovations in Deep-Scaled CMOS and FinFET Technologies
Multi-Gigahertz Nyquist Analog-to-Digital Converters Architecture and Circuit Innovations in Deep-Scaled CMOS and FinFET Technologies
Author 
Ramkaj, Athanasios T. author. Pelgrom, Marcel J.M. author. Steyaert, Michiel S. J. author. Tavernier, Filip. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22709-7
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54. 
Cover image for Receiver Design for High Spectral Efficiency Communication Systems in Beyond 5G
Receiver Design for High Spectral Efficiency Communication Systems in Beyond 5G
Author 
Yuan, Weijie. author. Wu, Nan. author. Kuang, Jingming. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-8090-9
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55. 
Cover image for Frontier Computing Theory, Technologies and Applications (FC 2022)
Frontier Computing Theory, Technologies and Applications (FC 2022)
Author 
Hung, Jason C. editor. Yen, Neil Y. editor. Chang, Jia-Wei. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1428-9
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56. 
Cover image for Hardware Security Primitives
Hardware Security Primitives
Author 
Tehranipoor, Mark. author. Pundir, Nitin. author. Vashistha, Nidish. author. Farahmandi, Farimah. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19185-5
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57. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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58. 
Cover image for Designing Mobile Robot Interfaces with 16-bit Microchip Microcontrollers
Designing Mobile Robot Interfaces with 16-bit Microchip Microcontrollers
Author 
Bindal, Ahmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-27841-9
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59. 
Cover image for Mathematical Modeling of Physical Systems Applications of Fields, Circuits and Signal Processing
Mathematical Modeling of Physical Systems Applications of Fields, Circuits and Signal Processing
Author 
Chattopadhyay, Adhir Baran. author. Hasan, Shazia. author. Chowdhury, Snehaunshu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7558-5
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60. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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