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49. 
Cover image for Continuous-Time Digital Front-Ends for Multistandard Wireless Transmission
Continuous-Time Digital Front-Ends for Multistandard Wireless Transmission
Author 
Nuyts, Pieter A. J. author. Reynaert, Patrick. author. Dehaene, Wim. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-03925-1
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50. 
Cover image for Design and Analysis of Spiral Inductors
Design and Analysis of Spiral Inductors
Author 
Haobijam, Genemala. author. Palathinkal, Roy Paily. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-1515-8
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51. 
Cover image for Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Author 
Tan, Nianxiong Nick. editor. Li, Dongmei. editor. Wang, Zhihua. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4419-9973-3
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52. 
Cover image for High-Bandwidth Memory Interface
High-Bandwidth Memory Interface
Author 
Kim, Chulwoo. author. Lee, Hyun-Woo. author. Song, Junyoung. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-02381-6
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53. 
Cover image for Terahertz Planar Antennas for Next Generation Communication
Terahertz Planar Antennas for Next Generation Communication
Author 
Jha, Kumud Ranjan. author. Singh, Ghanshyam. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-02341-0
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54. 
Cover image for Hybrid Fault Tolerance Techniques to Detect Transient Faults in Embedded Processors
Hybrid Fault Tolerance Techniques to Detect Transient Faults in Embedded Processors
Author 
Azambuja, José Rodrigo. author. Kastensmidt, Fernanda. author. Becker, Jürgen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06340-9
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55. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-1761-3
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56. 
Cover image for Advanced Symbolic Analysis for VLSI Systems Methods and Applications
Advanced Symbolic Analysis for VLSI Systems Methods and Applications
Author 
Shi, Guoyong. author. Tan, Sheldon X.-D. author. Tlelo Cuautle, Esteban. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4939-1103-5
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57. 
Cover image for Non-Linear Feedback Neural Networks VLSI Implementations and Applications
Non-Linear Feedback Neural Networks VLSI Implementations and Applications
Author 
Ansari, Mohd. Samar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-1563-9
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58. 
Cover image for System Level ESD Protection
System Level ESD Protection
Author 
Vashchenko, Vladislav. author. Scholz, Mirko. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03221-4
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59. 
Cover image for Designing 2D and 3D Network-on-Chip Architectures
Designing 2D and 3D Network-on-Chip Architectures
Author 
Tatas, Konstantinos. author. Siozios, Kostas. author. Soudris, Dimitrios. author. Jantsch, Axel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-4274-5
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60. 
Cover image for Embedded Systems Development From Functional Models to Implementations
Embedded Systems Development From Functional Models to Implementations
Author 
Sangiovanni-Vincentelli, Alberto. editor. Zeng, Haibo. editor. Di Natale, Marco. editor. Marwedel, Peter. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-3879-3
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