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49. 
Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-08778-3
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50. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-09853-6
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51. 
Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-19-4353-9
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52. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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53. 
Cover image for Network of Things Engineering (NoTE) Lab
Network of Things Engineering (NoTE) Lab
Author 
Jukan, Admela. author. Masip-Bruin, Xavi. author. Dizdarević, Jasenka. author. Carpio, Francisco. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20635-1
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54. 
Cover image for Cloud Computing with Security and Scalability. Concepts and Practices
Cloud Computing with Security and Scalability. Concepts and Practices
Author 
Sehgal, Naresh Kumar. author. Bhatt, Pramod Chandra P. author. Acken, John M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-07242-0
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55. 
Cover image for Basic Electronic Circuits Problems and Solutions
Basic Electronic Circuits Problems and Solutions
Author 
Vasudevan, K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09363-0
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56. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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57. 
Cover image for Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Applications in Electronics Pervading Industry, Environment and Society APPLEPIES 2022
Author 
Berta, Riccardo. editor. De Gloria, Alessandro. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30333-3
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58. 
Cover image for Graphs in VLSI
Graphs in VLSI
Author 
Bairamkulov, Rassul. author. Friedman, Eby G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11047-4
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59. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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60. 
Cover image for Signals and Systems A Practical Approach
Signals and Systems A Practical Approach
Author 
Sundararajan, D. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19377-4
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