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49. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b138345
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50. 
Cover image for Ultrathin Magnetic Structures I An Introduction to the Electronic, Magnetic and Structural Properties
Ultrathin Magnetic Structures I An Introduction to the Electronic, Magnetic and Structural Properties
Author 
Bland, J. Anthony C. Heinrich, Bretislav. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138789
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51. 
Cover image for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author 
Imanaka, Yoshihiko. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b101196
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52. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
Author 
Ogale, Satischandra B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136780
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53. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
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Yu, Peter Y. Cardona, Manuel. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137661
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