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1. 
Cover image for ICSBE 2022 Proceedings of the 13th International Conference on Sustainable Built Environment
ICSBE 2022 Proceedings of the 13th International Conference on Sustainable Built Environment
Author 
Dissanayake, Ranjith. editor. Mendis, Priyan. editor. Weerasekera, Kolita. editor. De Silva, Sudhira. editor. Fernando, Shiromal. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-3471-3
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2. 
Cover image for American and Australasian Marsupials An Evolutionary, Biogeographical, and Ecological Approach
American and Australasian Marsupials An Evolutionary, Biogeographical, and Ecological Approach
Author 
Cáceres, Nilton C. editor. Dickman, Christopher R. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-08419-5
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3. 
Cover image for Characterization of Cereals and Flours : Properties, Analysis And Applications
Characterization of Cereals and Flours : Properties, Analysis And Applications
Author 
Breslauer, Kenneth J., editor. Kaletunc, Gonul, editor. Taylor and Francis.
Preferred Shelf Number 
TX557
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4. 
Cover image for Modelling and simulation in the science of micro- and meso-porous materials
Modelling and simulation in the science of micro- and meso-porous materials
Author 
Catlow, C. R. A. (Charles Richard Arthur), 1947- Van Speybroeck, Veronique. Santen, R. A. van (Rutger A.)
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ScienceDirect http://www.sciencedirect.com/science/book/9780128050576
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5. 
Cover image for Metallurgy and design of alloys with hierarchical microstructures
Metallurgy and design of alloys with hierarchical microstructures
Author 
Sankaran, Krishnan K., author. Mishra, Rajiv S., author.
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ONLINE
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ScienceDirect http://www.sciencedirect.com/science/book/9780128120682
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6. 
Cover image for Laser Additive Manufacturing of High-Performance Materials
Laser Additive Manufacturing of High-Performance Materials
Author 
Gu, Dongdong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-46089-4
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7. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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8. 
Cover image for Biblical Lexicology: Hebrew and Greek : Semantics - Exegesis - Translation
Biblical Lexicology: Hebrew and Greek : Semantics - Exegesis - Translation
Author 
Bons, Eberhard, contributor. Bons, Eberhard, editor. Clines, David J. A., contributor. Dietrich, Walter, contributor. Dogniez, Cécile, contributor.
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Electronic Access 
https://doi.org/10.1515/9783110312164
https://www.degruyter.com/isbn/9783110312164
Cover https://www.degruyter.com/document/cover/isbn/9783110312164/original
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9. 
Cover image for Multiscale Characterization of Biological Systems Spectroscopy and Modeling
Multiscale Characterization of Biological Systems Spectroscopy and Modeling
Author 
Tomar, Vikas. author. Qu, Tao. author. Dubey, Devendra K. author. Verma, Devendra. author. Zhang, Yang. author.
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ONLINE
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https://doi.org/10.1007/978-1-4939-3453-9
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10. 
Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Author 
Voyiadjis, George Z. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-1-4614-5589-9
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11. 
Cover image for Calcined Clays for Sustainable Concrete Proceedings of the 1st International Conference on Calcined Clays for Sustainable Concrete
Calcined Clays for Sustainable Concrete Proceedings of the 1st International Conference on Calcined Clays for Sustainable Concrete
Author 
Scrivener, Karen. editor. Favier, Aurélie. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9939-3
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12. 
Cover image for Ubiquitous Computing Application and Wireless Sensor UCAWSN-14
Ubiquitous Computing Application and Wireless Sensor UCAWSN-14
Author 
Park, James J. (Jong Hyuk). editor. Pan, Yi. editor. Chao, Han-Chieh. editor. Yi, Gangman. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9618-7
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