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49. 
Cover image for Artificial Intelligence Applications and Innovations 19th IFIP WG 12.5 International Conference, AIAI 2023, León, Spain, June 14-17, 2023, Proceedings, Part I
Artificial Intelligence Applications and Innovations 19th IFIP WG 12.5 International Conference, AIAI 2023, León, Spain, June 14-17, 2023, Proceedings, Part I
Author 
Maglogiannis, Ilias. editor. Iliadis, Lazaros. editor. (orcid) MacIntyre, John. editor. Dominguez, Manuel. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520425.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-34111-3
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50. 
Cover image for Computational Intelligence in Data Science 6th IFIP TC 12 International Conference, ICCIDS 2023, Chennai, India, February 23-25, 2023, Revised Selected Papers
Computational Intelligence in Data Science 6th IFIP TC 12 International Conference, ICCIDS 2023, Chennai, India, February 23-25, 2023, Revised Selected Papers
Author 
Chandran K R, Sarath. editor. N, Sujaudeen. editor. A, Beulah. editor. Hamead H, Shahul. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520518.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-38296-3
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51. 
Cover image for Technological Innovation for Connected Cyber Physical Spaces 14th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2023, Caparica, Portugal, July 5-7, 2023, Proceedings
Technological Innovation for Connected Cyber Physical Spaces 14th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2023, Caparica, Portugal, July 5-7, 2023, Proceedings
Author 
Camarinha-Matos, Luis M. editor. Ferrada, Filipa. editor. (orcid) SpringerLink (Online service)
Preferred Shelf Number 
XX(520472.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-36007-7
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52. 
Cover image for Towards a Collaborative Society Through Creative Learning IFIP World Conference on Computers in Education, WCCE 2022, Hiroshima, Japan, August 20-24, 2022, Revised Selected Papers
Towards a Collaborative Society Through Creative Learning IFIP World Conference on Computers in Education, WCCE 2022, Hiroshima, Japan, August 20-24, 2022, Revised Selected Papers
Author 
Keane, Therese. editor. (orcid) Lewin, Cathy. editor. Brinda, Torsten. editor. Bottino, Rosa. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520643.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-43393-1
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53. 
Cover image for After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings
After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings
Author 
Jones, Matthew R. editor. Mukherjee, Arunima S. editor. Thapa, Devinder. editor. Zheng, Yingqin. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520744.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-50154-8
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54. 
Cover image for Product Lifecycle Management. PLM in Transition Times: The Place of Humans and Transformative Technologies 19th IFIP WG 5.1 International Conference, PLM 2022, Grenoble, France, July 10-13, 2022, Revised Selected Papers
Product Lifecycle Management. PLM in Transition Times: The Place of Humans and Transformative Technologies 19th IFIP WG 5.1 International Conference, PLM 2022, Grenoble, France, July 10-13, 2022, Revised Selected Papers
Author 
Noël, Frédéric. editor. Nyffenegger, Felix. editor. (orcid) Rivest, Louis. editor. Bouras, Abdelaziz. editor. (orcid) SpringerLink (Online service)
Preferred Shelf Number 
XX(520558.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-25182-5
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55. 
Cover image for Lean, Green and Sustainability 8th IFIP WG 5.7 European Lean Educator Conference, ELEC 2022, Galway, Ireland, November 22-24, 2022, Proceedings
Lean, Green and Sustainability 8th IFIP WG 5.7 European Lean Educator Conference, ELEC 2022, Galway, Ireland, November 22-24, 2022, Proceedings
Author 
McDermott, Olivia. editor. Rosa, Angelo. editor. Sá, José Carlos. editor. Toner, Aidan. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520562.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-25741-4
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56. 
Cover image for Analysis, Estimations, and Applications of Embedded Systems 6th IFIP TC 10 International Embedded Systems Symposium, IESS 2019, Friedrichshafen, Germany, September 9-11, 2019, Revised Selected Papers
Analysis, Estimations, and Applications of Embedded Systems 6th IFIP TC 10 International Embedded Systems Symposium, IESS 2019, Friedrichshafen, Germany, September 9-11, 2019, Revised Selected Papers
Author 
Wehrmeister, Marco A. editor. Kreutz, Márcio. editor. Götz, Marcelo. editor. Henkler, Stefan. editor. Pimentel, Andy D. editor.
Preferred Shelf Number 
XX(520563.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-26500-6
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57. 
Cover image for Information Technology in Disaster Risk Reduction 7th IFIP WG 5.15 International Conference, ITDRR 2022, Kristiansand, Norway, October 12-14, 2022, Revised Selected Papers
Information Technology in Disaster Risk Reduction 7th IFIP WG 5.15 International Conference, ITDRR 2022, Kristiansand, Norway, October 12-14, 2022, Revised Selected Papers
Author 
Gjøsæter, Terje. editor. (orcid) Radianti, Jaziar. editor. Murayama, Yuko. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520582.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-34207-3
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58. 
Cover image for Privacy and Identity Management 17th IFIP WG 9.2, 9.6/11.7, 11.6/SIG 9.2.2 International Summer School, Privacy and Identity 2022, Virtual Event, August 30-September 2, 2022, Proceedings
Privacy and Identity Management 17th IFIP WG 9.2, 9.6/11.7, 11.6/SIG 9.2.2 International Summer School, Privacy and Identity 2022, Virtual Event, August 30-September 2, 2022, Proceedings
Author 
Bieker, Felix. editor. Meyer, Joachim. editor. Pape, Sebastian. editor. Schiering, Ina. editor. Weich, Andreas. editor.
Preferred Shelf Number 
XX(520583.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-31971-6
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59. 
Cover image for Artificial Intelligence Applications and Innovations. AIAI 2023 IFIP WG 12.5 International Workshops MHDW 2023, 5G-PINE 2023, ΑΙBMG 2023, and VAA-CP-EB 2023, León, Spain, June 14-17, 2023, Proceedings
Artificial Intelligence Applications and Innovations. AIAI 2023 IFIP WG 12.5 International Workshops MHDW 2023, 5G-PINE 2023, ΑΙBMG 2023, and VAA-CP-EB 2023, León, Spain, June 14-17, 2023, Proceedings
Author 
Maglogiannis, Ilias. editor. (orcid) Iliadis, Lazaros. editor. (orcid) Papaleonidas, Antonios. editor. (orcid) Chochliouros, Ioannis. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520584.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-34171-7
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60. 
Cover image for Designing Modern Embedded Systems: Software, Hardware, and Applications 7th IFIP TC 10 International Embedded Systems Symposium, IESS 2022, Lippstadt, Germany, November 3-4, 2022, Proceedings
Designing Modern Embedded Systems: Software, Hardware, and Applications 7th IFIP TC 10 International Embedded Systems Symposium, IESS 2022, Lippstadt, Germany, November 3-4, 2022, Proceedings
Author 
Henkler, Stefan. editor. Kreutz, Márcio. editor. Wehrmeister, Marco A. editor. Götz, Marcelo. editor. Rettberg, Achim. editor.
Preferred Shelf Number 
XX(520586.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-34214-1
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