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1. 
Cover image for The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
Author 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-8812-5
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Cover image for Imaging Sensors, Power Management, PLLs and Frequency Synthesizers Advances in Analog Circuit Design 2023
Imaging Sensors, Power Management, PLLs and Frequency Synthesizers Advances in Analog Circuit Design 2023
Author 
Makinwa, Kofi A. A. editor. Baschirotto, Andrea. editor. Nauta, Bram. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-71559-4
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3. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
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Jackson, Mark J. editor. (orcid)0000-0001-9087-3515 Ahmed, Waqar. editor. (orcid)0000-0003-4152-5172 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-70499-4
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4. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume III
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-1383-0
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5. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume IV
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume IV
Author 
Jia, Limin. editor. Lv, Yanling. editor. Yang, Qiang. editor. (orcid)0000-0002-0761-4692 Xiong, Liansong. editor. Sun, Dongyang. editor.
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https://doi.org/10.1007/978-981-96-2050-0
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6. 
Cover image for Revealing Hybrid DC-DC Converters
Revealing Hybrid DC-DC Converters
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Huang, Mo. author. (orcid)0000-0003-0497-194X Martins, Rui Paulo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-86350-9
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7. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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8. 
Cover image for CMOS-based Portable NMR/MRI Microsystems
CMOS-based Portable NMR/MRI Microsystems
Author 
Fan, Shuhao. author. Zhou, Qi. author. (orcid)0000-0002-3949-7953 Lei, Ka-Meng. author. Martins, Rui P. author. Mak, Pui-In. author.
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https://doi.org/10.1007/978-3-031-91447-8
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9. 
Cover image for Principles of Electrical Measurement and Measuring Instruments
Principles of Electrical Measurement and Measuring Instruments
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Jagadeesh Kumar, V. author. (orcid)0000-0002-2575-5632 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-5475-8
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10. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume I
A Problem-Solving Approach to Electric Circuits Volume I
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95623-2
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11. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume II
A Problem-Solving Approach to Electric Circuits Volume II
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Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95634-8
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12. 
Cover image for Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Author 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
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https://doi.org/10.1007/978-981-97-7255-1
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