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1. 
Cover image for 3D TCAD Simulation for CMOS Nanoeletronic Devices
3D TCAD Simulation for CMOS Nanoeletronic Devices
Author 
Wu, Yung-Chun. author. Jhan, Yi-Ruei. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-10-3066-6
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2. 
Cover image for Sensors Proceedings of the Third National Conference on Sensors, February 23-25, 2016, Rome, Italy
Sensors Proceedings of the Third National Conference on Sensors, February 23-25, 2016, Rome, Italy
Author 
Andò, Bruno. editor. Baldini, Francesco. editor. Di Natale, Corrado. editor. Marrazza, Giovanna. editor. Siciliano, Pietro. editor.
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Electronic Access 
https://doi.org/10.1007/978-3-319-55077-0
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3. 
Cover image for Recent Trends in Control and Sensor Systems in Emergency Management
Recent Trends in Control and Sensor Systems in Emergency Management
Author 
Szewczyk, Roman. editor. Havlik, Denis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70452-4
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4. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
Author 
Jackson, Mark J. editor. Ahmed, Waqar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-67132-1
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5. 
Cover image for Sensors and Microsystems Proceedings of the 19th AISEM 2017 National Conference
Sensors and Microsystems Proceedings of the 19th AISEM 2017 National Conference
Author 
Leone, Alessandro. editor. Forleo, Angiola. editor. Francioso, Luca. editor. Capone, Simona. editor. Siciliano, Pietro. editor.
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https://doi.org/10.1007/978-3-319-66802-4
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6. 
Cover image for Handbook of Thermal Science and Engineering
Handbook of Thermal Science and Engineering
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SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-26695-4
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7. 
Cover image for A Brief History of Mechanical Engineering
A Brief History of Mechanical Engineering
Author 
Dixit, Uday Shanker. author. Hazarika, Manjuri. author. Davim, J. Paulo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-42916-8
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8. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE(330808.1)
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http://dx.doi.org/10.1007/978-1-4419-5768-9
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9. 
Cover image for Embedded Systems for Smart Appliances and Energy Management
Embedded Systems for Smart Appliances and Energy Management
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Grimm, Christoph. editor. Neumann, Peter. editor. Mahlknecht, Stefan. editor. SpringerLink (Online service)
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ONLINE(330846.1)
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http://dx.doi.org/10.1007/978-1-4419-8795-2
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10. 
Cover image for MEMS-based Circuits and Systems for Wireless Communication
MEMS-based Circuits and Systems for Wireless Communication
Author 
Enz, Christian C. editor. Kaiser, Andreas. editor. SpringerLink (Online service)
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ONLINE(330847.1)
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http://dx.doi.org/10.1007/978-1-4419-8798-3
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11. 
Cover image for Three-phase AC-AC Power Converters Based on Matrix Converter Topology Matrix-reactance frequency converters concept
Three-phase AC-AC Power Converters Based on Matrix Converter Topology Matrix-reactance frequency converters concept
Author 
Szcześniak, Paweł. author. SpringerLink (Online service)
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ONLINE(331090.1)
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http://dx.doi.org/10.1007/978-1-4471-4896-8
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12. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
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ONLINE(331292.1)
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http://dx.doi.org/10.1007/978-1-4614-1963-1
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