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49. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-94-007-1229-4
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50. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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51. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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52. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19489-4
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53. 
Cover image for Fundamentals of Superconducting Nanoelectronics
Fundamentals of Superconducting Nanoelectronics
Author 
Sidorenko, Anatolie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20158-5
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54. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0778-2
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55. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-236-0
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56. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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57. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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58. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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59. 
Cover image for Cellular Nanoscale Sensory Wave Computing
Cellular Nanoscale Sensory Wave Computing
Author 
Baatar, Chagaan. editor. Porod, Wolfgang. editor. Roska, Tamás. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1011-0
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60. 
Cover image for Device Physics of Narrow Gap Semiconductors
Device Physics of Narrow Gap Semiconductors
Author 
Chu, Junhao. author. Sher, Arden. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1040-0
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