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49. 
Cover image for Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Author 
Franco, Jacopo. author. Kaczer, Ben. author. Groeseneken, Guido. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-94-007-7663-0
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50. 
Cover image for Non-Linear Feedback Neural Networks VLSI Implementations and Applications
Non-Linear Feedback Neural Networks VLSI Implementations and Applications
Author 
Ansari, Mohd. Samar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-1563-9
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51. 
Cover image for SystemVerilog Assertions and Functional Coverage Guide to Language, Methodology and Applications
SystemVerilog Assertions and Functional Coverage Guide to Language, Methodology and Applications
Author 
Mehta, Ashok B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-7324-4
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52. 
Cover image for Turbo Decoder Architecture for Beyond-4G Applications
Turbo Decoder Architecture for Beyond-4G Applications
Author 
Wong, Cheng-Chi. author. Chang, Hsie-Chia. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8310-6
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53. 
Cover image for Applications in Electronics Pervading Industry, Environment and Society
Applications in Electronics Pervading Industry, Environment and Society
Author 
De Gloria, Alessandro. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-04370-8
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54. 
Cover image for Advanced DC/AC inverters : applications in renewable energy
Advanced DC/AC inverters : applications in renewable energy
Author 
Luo, Fang Lin., author. Ye, Hong, 1973-
Preferred Shelf Number 
TK2791 .L86 2012
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55. 
Cover image for Analog circuits and devices
Analog circuits and devices
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Chen, Wai-Kai, 1936-
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TK7870 .A529 2003
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56. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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57. 
Cover image for Proceedings of the 2nd International Conference on Signal and Data Processing ICSDP 2022
Proceedings of the 2nd International Conference on Signal and Data Processing ICSDP 2022
Author 
Ray, K. P. editor. Dixit, Arati. editor. Adhikari, Debashis. editor. Mathew, Ribu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1410-4
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58. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
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Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0055-8
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59. 
Cover image for High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
High-Z Materials for X-ray Detection Material Properties and Characterization Techniques
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Abbene, Leonardo. editor. Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20955-0
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60. 
Cover image for Digital Design from the VLSI Perspective Concepts for VLSI Beginners
Digital Design from the VLSI Perspective Concepts for VLSI Beginners
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Taraate, Vaibbhav. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4652-3
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