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49. 
Cover image for Physics of Collisional Plasmas Introduction to High-Frequency Discharges
Physics of Collisional Plasmas Introduction to High-Frequency Discharges
Author 
Moisan, Michel. author. Pelletier, Jacques. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-4558-2
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50. 
Cover image for Machining with Abrasives
Machining with Abrasives
Author 
Jackson, Mark J. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7302-3
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51. 
Cover image for Master handbook of acoustics
Master handbook of acoustics
Author 
Everest, F. Alton (Frederick Alton), 1909-2005. Pohlmann, Ken C.
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52. 
Cover image for Leistungselektronik Ein Handbuch Band 1 / Band 2
Leistungselektronik Ein Handbuch Band 1 / Band 2
Author 
Zach, Franz. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-89214-5
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53. 
Cover image for The Physics of Metrology All about Instruments: From Trundle Wheels to Atomic Clocks
The Physics of Metrology All about Instruments: From Trundle Wheels to Atomic Clocks
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Hebra, Alexius J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-78381-8
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54. 
Cover image for Electromagnetic Compatibility for Device Design and System Integration
Electromagnetic Compatibility for Device Design and System Integration
Author 
Gonschorek, Karl-Heinz. author. Vick, Ralf. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-03290-5
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55. 
Cover image for Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Author 
Hahn, Hernsoo. editor. Ko, Hanseok. editor. Lee, Sukhan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-89859-7
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56. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4589-1
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