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49. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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50. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-19131-2
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51. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19489-4
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52. 
Cover image for Fundamentals of Superconducting Nanoelectronics
Fundamentals of Superconducting Nanoelectronics
Author 
Sidorenko, Anatolie. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-642-20158-5
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53. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-7091-0778-2
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54. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-94-007-1229-4
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55. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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56. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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57. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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58. 
Cover image for Fundamentals of III-V Semiconductor MOSFETs
Fundamentals of III-V Semiconductor MOSFETs
Author 
Oktyabrsky, Serge. editor. Ye, Peide. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1547-4
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59. 
Cover image for Dielectric Polymer Nanocomposites
Dielectric Polymer Nanocomposites
Author 
Nelson, J. Keith. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-1591-7
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60. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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