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49. 
Cover image for Nanoscale Phenomena Basic Science to Device Applications
Nanoscale Phenomena Basic Science to Device Applications
Author 
Tang, Zikang. editor. Sheng, Ping. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-73048-6
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50. 
Cover image for Physics and Properties of Narrow Gap Semiconductors
Physics and Properties of Narrow Gap Semiconductors
Author 
Chu, Junhao. author. Sher, Arden. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74801-6
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51. 
Cover image for Evolution of Thin Film Morphology Modeling and Simulations
Evolution of Thin Film Morphology Modeling and Simulations
Author 
Pelliccione, Matthew. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-75109-2
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52. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-76534-1
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53. 
Cover image for Semiconductor Nanostructures
Semiconductor Nanostructures
Author 
Bimberg, Dieter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77899-8
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54. 
Cover image for Frontiers in Materials Research
Frontiers in Materials Research
Author 
Fujikawa, Yasunori. editor. Nakajima, Kazuo. editor. Sakurai, Toshio. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-77968-1
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55. 
Cover image for Springer Handbook of Electronic and Photonic Materials
Springer Handbook of Electronic and Photonic Materials
Author 
Kasap, Safa. editor. Capper, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29185-7
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56. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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57. 
Cover image for Materials Chemistry
Materials Chemistry
Author 
Fahlman, Bradley D. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6120-2
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58. 
Cover image for Plasmonics: Fundamentals and Applications
Plasmonics: Fundamentals and Applications
Author 
Maier, Stefan A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-37825-1
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59. 
Cover image for Scanning Microscopy for Nanotechnology Techniques and Applications
Scanning Microscopy for Nanotechnology Techniques and Applications
Author 
Zhou, Weilie. editor. Wang, Zhong Lin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-39620-0
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60. 
Cover image for Ceramic Materials Science and Engineering
Ceramic Materials Science and Engineering
Author 
Carter, C. Barry. author. Norton, M. Grant. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-46271-4
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