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73. 
Cover image for Transport Processes in Porous Media
Transport Processes in Porous Media
Author 
Coutelieris, Frank A. author. Delgado, J.M.P.Q. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27910-2
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74. 
Cover image for Proceedings of the 10th International Congress for Applied Mineralogy (ICAM)
Proceedings of the 10th International Congress for Applied Mineralogy (ICAM)
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Broekmans, Maarten A.T.M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27682-8
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75. 
Cover image for Computational modelling of objects represented in images fundamentals, methods and applications III : proceedings of the International Symposium Compimage 2012, Rome, Italy, 5-7 September 2012
Computational modelling of objects represented in images fundamentals, methods and applications III : proceedings of the International Symposium Compimage 2012, Rome, Italy, 5-7 September 2012
Author 
CompIMAGE 2012 (2012 : Rome, Italy) Di Giamberardino, Paolo.
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76. 
Cover image for Ultrasonic nondestructive testing of materials theoretical foundations
Ultrasonic nondestructive testing of materials theoretical foundations
Author 
Langenberg, Karl-Jorg. Marklein, Rene. Mayer, Klaus, 1954-
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77. 
Cover image for Molecular modeling for the design of novel performance chemicals and materials
Molecular modeling for the design of novel performance chemicals and materials
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Rai, Beena.
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78. 
Cover image for Computational Viscoelasticity
Computational Viscoelasticity
Author 
Marques, Severino P. C. author. Creus, Guillermo J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-25311-9
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79. 
Cover image for Mathematical Modeling in Mechanics of Granular Materials
Mathematical Modeling in Mechanics of Granular Materials
Author 
Sadovskaya, Oxana. author. Sadovskii, Vladimir. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-29053-4
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80. 
Cover image for Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Author 
Laurila, Tomi. author. Vuorinen, Vesa. author. Paulasto-Kröckel, Mervi. author. Turunen, Markus. author. Mattila, Toni T. author.
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http://dx.doi.org/10.1007/978-1-4471-2470-2
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81. 
Cover image for Uniting Electron Crystallography and Powder Diffraction
Uniting Electron Crystallography and Powder Diffraction
Author 
Kolb, Ute. editor. Shankland, Kenneth. editor. Meshi, Louisa. editor. Avilov, Anatoly. editor. David, William I.F. editor.
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http://dx.doi.org/10.1007/978-94-007-5580-2
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82. 
Cover image for Damage and Fracture of Composite Materials and Structures
Damage and Fracture of Composite Materials and Structures
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Tamin, Mohd Nasir. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-23659-4
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83. 
Cover image for Theory of Charge Transport in Carbon Electronic Materials
Theory of Charge Transport in Carbon Electronic Materials
Author 
Shuai, Zhigang. author. Wang, Linjun. author. Song, Chenchen. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-25076-7
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84. 
Cover image for Conducting Polymers A New Era in Electrochemistry
Conducting Polymers A New Era in Electrochemistry
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Inzelt, György. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27621-7
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