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109. 
Cover image for A New Family of CMOS Cascode-Free Amplifiers with High Energy-Efficiency and Improved Gain
A New Family of CMOS Cascode-Free Amplifiers with High Energy-Efficiency and Improved Gain
Author 
Póvoa, Ricardo Filipe Sereno. author. Goes, João Carlos da Palma. author. Horta, Nuno Cavaco Gomes. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-95207-9
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110. 
Cover image for Current-Mode Instrumentation Amplifiers
Current-Mode Instrumentation Amplifiers
Author 
Safari, Leila. author. Ferri, Giuseppe. author. Minaei, Shahram. author. Stornelli, Vincenzo. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-01343-1
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111. 
Cover image for Safe, Autonomous and Intelligent Vehicles
Safe, Autonomous and Intelligent Vehicles
Author 
Yu, Huafeng. editor. Li, Xin. editor. Murray, Richard M. editor. Ramesh, S. editor. Tomlin, Claire J. editor.
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https://doi.org/10.1007/978-3-319-97301-2
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112. 
Cover image for Fundamentals of Computer Architecture and Design
Fundamentals of Computer Architecture and Design
Author 
Bindal, Ahmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-00223-7
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113. 
Cover image for The Impact of Service Oriented Architecture Adoption on Organizations
The Impact of Service Oriented Architecture Adoption on Organizations
Author 
Niknejad, Naghmeh. author. Hussin, Ab Razak Che. author. Amiri, Iraj Sadegh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-12100-6
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114. 
Cover image for m-Mode SVPWM Technique for Power Converters
m-Mode SVPWM Technique for Power Converters
Author 
Zhang, Bo. author. Qiu, Dongyuan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-1382-0
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115. 
Cover image for Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms A Cross-layer Approach
Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms A Cross-layer Approach
Author 
Fornaciari, William. editor. Soudris, Dimitrios. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-91962-1
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116. 
Cover image for The IoT Physical Layer Design and Implementation
The IoT Physical Layer Design and Implementation
Author 
Elfadel, Ibrahim (Abe) M. editor. Ismail, Mohammed. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-93100-5
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117. 
Cover image for Post-Silicon Validation and Debug
Post-Silicon Validation and Debug
Author 
Mishra, Prabhat. editor. Farahmandi, Farimah. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-98116-1
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118. 
Cover image for Exact Design of Digital Microfluidic Biochips
Exact Design of Digital Microfluidic Biochips
Author 
Keszocze, Oliver. author. Wille, Robert. author. Drechsler, Rolf. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90936-3
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119. 
Cover image for Electronically Scanned Arrays (ESAs) and K-Space Gain Formulation
Electronically Scanned Arrays (ESAs) and K-Space Gain Formulation
Author 
Dana, Roger A. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-04678-1
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120. 
Cover image for CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
Author 
Wang, Jing. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3378-1
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