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1. 
Cover image for Advances in imaging and electron physics.
Advances in imaging and electron physics.
Author 
Hawkes, Peter W., ed.
Preferred Shelf Number 
QC 793.5.E62 A3 V.127 2003
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2. 
Cover image for Alternatif akım devreleri ve problem çözümleri
Alternatif akım devreleri ve problem çözümleri
Author 
Yağımlı, Mustafa. Akar, Feyzi.
Preferred Shelf Number 
TK7816 Y25 2024
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3. 
Cover image for Basic Electronic Circuits Problems and Solutions
Basic Electronic Circuits Problems and Solutions
Author 
Vasudevan, K. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-09363-0
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4. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-658-41041-4
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5. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-1906-0
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6. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
Author 
Tran, Thanh T. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-04954-5
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7. 
Cover image for Introduction to Avionics Systems
Introduction to Avionics Systems
Author 
Collinson, R.P.G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29215-6
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8. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-1455-5
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9. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-30152-0
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10. 
Cover image for Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Author 
Triwiyanto, Triwiyanto. editor. Rizal, Achmad. editor. Caesarendra, Wahyu. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-0248-4
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11. 
Cover image for Springer Handbook of Semiconductor Devices
Springer Handbook of Semiconductor Devices
Author 
Rudan, Massimo. editor. Brunetti, Rossella. editor. Reggiani, Susanna. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-030-79827-7
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12. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-12818-9
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