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1. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-
Preferred Shelf Number 
ONLINE
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2. 
Cover image for Advanced electronic packaging
Advanced electronic packaging
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522
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3. 
Cover image for The electronic packaging handbook
The electronic packaging handbook
Author 
Blackwell, Glenn R.
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ONLINE
Electronic Access 
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4. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
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5. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28522-6
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6. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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7. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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8. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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9. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
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10. 
Cover image for Contamination of electronic assemblies
Contamination of electronic assemblies
Author 
Pecht, Michael.
Preferred Shelf Number 
TK7870.15 C66 2003
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11. 
Cover image for Electronic enclosures, housings and packages
Electronic enclosures, housings and packages
Author 
Süli, Frank, author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081023914
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12. 
Cover image for Extreme environment electronics
Extreme environment electronics
Author 
Cressler, John D. Mantooth, H. Alan, 1963-
Preferred Shelf Number 
ONLINE
Electronic Access 
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13. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437778779
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14. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
Preferred Shelf Number 
ONLINE
Electronic Access 
Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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15. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
Electronic Access 
Subscription required
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16. 
Cover image for Practical guide to the packaging of electronics thermal and mechanical design and analysis
Practical guide to the packaging of electronics thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961-
Preferred Shelf Number 
ONLINE
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17. 
Cover image for Ceramic interconnect technology handbook
Ceramic interconnect technology handbook
Author 
Barlow, Fred D. Elshabini, Aicha.
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ONLINE
Electronic Access 
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18. 
Cover image for Adhesives technology for electronic applications materials, processes, reliability
Adhesives technology for electronic applications materials, processes, reliability
Author 
Licari, James J., 1930- Swanson, Dale W.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815515135
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19. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
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20. 
Cover image for Lead-free soldering in electronics science, technology and environmental impact
Lead-free soldering in electronics science, technology and environmental impact
Author 
Suganuma, Katsuaki.
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ONLINE
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21. 
Cover image for Handbook of lead-free solder technology for microelectronic assemblies
Handbook of lead-free solder technology for microelectronic assemblies
Author 
Puttlitz, Karl J. Stalter, Kathleen A.
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22. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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23. 
Cover image for Thermal design of electronic equipment
Thermal design of electronic equipment
Author 
Remsburg, Ralph.
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24. 
Cover image for Run-to-run control in semiconductor manufacturing
Run-to-run control in semiconductor manufacturing
Author 
Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.
Preferred Shelf Number 
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25. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815514350
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26. 
Cover image for Electronic techniques : shop practices and construction
Electronic techniques : shop practices and construction
Author 
Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.
Preferred Shelf Number 
TK7836 .V55 1996
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27. 
Cover image for Microwave Field-Effect Transistors Theory, design and applications
Microwave Field-Effect Transistors Theory, design and applications
Author 
Pengelly, Raymond S.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/SBEW016E
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