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Cover image for Applied Reconfigurable Computing. Architectures, Tools, and Applications 19th International Symposium, ARC 2023, Cottbus, Germany, September 27-29, 2023, Proceedings
Applied Reconfigurable Computing. Architectures, Tools, and Applications 19th International Symposium, ARC 2023, Cottbus, Germany, September 27-29, 2023, Proceedings
Author 
Palumbo, Francesca. editor. Keramidas, Georgios. editor. Voros, Nikolaos. editor. Diniz, Pedro C. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521144.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-42921-7
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Cover image for Cryptography and Information Security in the Balkans First International Conference, BalkanCryptSec 2014, Istanbul, Turkey, October 16-17, 2014, Revised Selected Papers
Cryptography and Information Security in the Balkans First International Conference, BalkanCryptSec 2014, Istanbul, Turkey, October 16-17, 2014, Revised Selected Papers
Author 
Ors, Berna. editor. Preneel, Bart. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(518872.1)
Electronic Access 
https://doi.org/10.1007/978-3-319-21356-9
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3. 
Cover image for Applied Reconfigurable Computing 11th International Symposium, ARC 2015, Bochum, Germany, April 13-17, 2015, Proceedings
Applied Reconfigurable Computing 11th International Symposium, ARC 2015, Bochum, Germany, April 13-17, 2015, Proceedings
Author 
Sano, Kentaro. editor. Soudris, Dimitrios. editor. Hübner, Michael. editor. Diniz, Pedro C. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(519004.1)
Electronic Access 
https://doi.org/10.1007/978-3-319-16214-0
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4. 
Cover image for Multicore technology : architecture, reconfiguration, and modeling
Multicore technology : architecture, reconfiguration, and modeling
Author 
Samgwine, Stephen J., editor. Qadri, Muhammad Yasir, editor.
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ONLINE
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5. 
Cover image for Embedded Systems for Smart Appliances and Energy Management
Embedded Systems for Smart Appliances and Energy Management
Author 
Grimm, Christoph. editor. Neumann, Peter. editor. Mahlknecht, Stefan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330846.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8795-2
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6. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
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ONLINE(330852.1)
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http://dx.doi.org/10.1007/978-1-4419-9542-1
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7. 
Cover image for Model-Based Design of Adaptive Embedded Systems
Model-Based Design of Adaptive Embedded Systems
Author 
Basten, Twan. editor. Hamberg, Roelof. editor. Reckers, Frans. editor. Verriet, Jacques. editor. SpringerLink (Online service)
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ONLINE(331594.1)
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http://dx.doi.org/10.1007/978-1-4614-4821-1
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8. 
Cover image for Compilation and Synthesis for Embedded Reconfigurable Systems An Aspect-Oriented Approach
Compilation and Synthesis for Embedded Reconfigurable Systems An Aspect-Oriented Approach
Author 
Cardoso, João Manuel Paiva. editor. Diniz, Pedro C. editor. de Figueiredo Coutinho, José Gabriel. editor. Petrov, Zlatko Marinov. editor. SpringerLink (Online service)
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ONLINE(331615.1)
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http://dx.doi.org/10.1007/978-1-4614-4894-5
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9. 
Cover image for Design Technologies for Green and Sustainable Computing Systems
Design Technologies for Green and Sustainable Computing Systems
Author 
Pande, Partha Pratim. editor. Ganguly, Amlan. editor. Chakrabarty, Krishnendu. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331637.1)
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http://dx.doi.org/10.1007/978-1-4614-4975-1
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10. 
Cover image for Energy-Efficient Communication Processors Design and Implementation for Emerging Wireless Systems
Energy-Efficient Communication Processors Design and Implementation for Emerging Wireless Systems
Author 
Fasthuber, Robert. author. Catthoor, Francky. author. Raghavan, Praveen. author. Naessens, Frederik. author. SpringerLink (Online service)
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ONLINE(331642.1)
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http://dx.doi.org/10.1007/978-1-4614-4992-8
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11. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
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ONLINE(331791.1)
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http://dx.doi.org/10.1007/978-1-4614-5508-0
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12. 
Cover image for Facing the Multicore-Challenge III Aspects of New Paradigms and Technologies in Parallel Computing
Facing the Multicore-Challenge III Aspects of New Paradigms and Technologies in Parallel Computing
Author 
Keller, Rainer. editor. Kramer, David. editor. Weiss, Jan-Philipp. editor. SpringerLink (Online service)
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ONLINE(334079.1)
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http://dx.doi.org/10.1007/978-3-642-35893-7
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