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Shelf Location: Electronic Library

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Publication Date: 2000

Author

Anderson, L. R. (Loren Runar), 1941-

(2)

Chen, Wai-Fah, 1936-

(2)

(2)

Watkins, Reynold King.

(2)

Wiley InterScience (Online service)

(2)

(1)

(1)

(1)

Clark, David E., 1966-

(1)

Daly, James C., 1938-

(1)

Galipeau, Denis P.

(1)

Ganssle, Jack G.

(1)

Gerwick, Ben C.

(1)

Goldberg, Lee H.

(1)

Gudmestad, O. T. (Ove T.), 1947-

(1)

Heddle, D. W. O. (Douglas W. O.)

(1)

(1)

Hopwood, Jeffrey A.

(1)

IEEE Electromagnetic Compatibility Society.

(1)

Jackson, Kenneth A.

(1)

(1)

Kasper, Werner.

(1)

Kendall, Stephen.

(1)

Kularatna, Nihal.

(1)

Mamalis, Athanasios G.

(1)

Middleton, Wendy.

(1)

Montrose, Mark I.

(1)

Newkirk, David P.

(1)

O'Connor, Colin.

(1)

(1)

Perkins, Philip Harold.

(1)

Rohde, Ulrich L.

(1)

Sattler, Klaus, Prof.

(1)

Schröter, W. (Wolfgang)

(1)

Shaw, Peter A. (Peter Arthur)

(1)

Teicher, Jonathan.

(1)

Whitaker, Jerry C.

(1)

Language

(23)

(1)

Subject

Electronic books.

(5)

Bridges -- Design and construction.

(3)

Structural analysis (Engineering)

(3)

Earth pressure.

(2)

Offshore structures -- Design and construction.

(2)

Semiconductors -- Design and construction.

(2)

Soil-structure interaction.

(2)

Underground pipelines -- Design and construction.

(2)

(1)

Bipolar integrated circuits -- Design and construction.

(1)

Bridges -- Live loads.

(1)

Chemical engineering.

(1)

Chemical plants -- Design and construction -- Computer simulation.

(1)

Chemical plants -- Design and construction.

(1)

Chemical plants -- Environmental aspects -- Computer simulation.

(1)

Circuit imprimé

(1)

Circuitos impressos (design)

(1)

Compatibilidade eletromagnética.

(1)

Compatibilité électromagnétique.

(1)

Compound semiconductors.

(1)

Computer-Aided Design.

(1)

Concrete construction.

(1)

(1)

Drugs -- Design and construction.

(1)

Dwellings -- Design and construction.

(1)

Electromagnetic compatibility.

(1)

Electronic apparatus and appliances -- Design and construction -- Safety measures.

(1)

Electronic apparatus and appliances -- Design and construction -- Safety measures. Electronics. Electronic industries. Green products. Environmental protection.

(1)

Electronic apparatus and appliances -- Materials.

(1)

Electronic apparatus and appliances.

(1)

Electronic circuit design.

(1)

Electronic industries.

(1)

Electronic structure.

(1)

Electronic systems -- Design and construction.

(1)

(1)

Electrostatic lenses -- Design and construction -- Data processing.

(1)

Electrostatic lenses.

(1)

Elektrotechnik.

(1)

Embedded computer systems -- Design and construction.

(1)

Embedded computer systems -- Design.

(1)

Environmental protection.

(1)

Evolution, Molecular.

(1)

Evolutionary programming (Computer science)

(1)

Genetic algorithms.

(1)

Green electronics.

(1)

High temperature superconductors -- Design and construction.

(1)

Linear integrated circuits -- Design and construction.

(1)

Load factor design.

(1)

Low voltage systems -- Design and construction.

(1)

Metal oxide semiconductors, Complementary -- Design and construction.

(1)

Microwave circuits -- Design and construction.

(1)

Microwave integrated circuits -- Computer-aided design.

(1)

Molecules -- Models -- Design and construction.

(1)

Open plan (Building)

(1)

Physical vapor deposition.

(1)

Pollution -- Computer simulation.

(1)

Power electronics -- Design and construction.

(1)

Printed circuits -- Design and construction.

(1)

Production engineering.

(1)

Radio frequency integrated circuits -- Design and construction.

(1)

Semiconductors -- Analysis.

(1)

Semiconductors -- Computer-aided design.

(1)

Semiconductors -- Defects.

(1)

Semiconductors -- Materials.

(1)

Steel framing (Building)

(1)

Steel, Structural.

(1)

Structural analysis.

(1)

Structural frames -- Design and construction.

(1)

Swimming pools -- Design and construction.

(1)

Systems engineering.

(1)

Thin film devices -- Design and construction.

(1)

(1)

Umweltverträgliches Produkt.

(1)

Waste minimization -- Computer simulation.

(1)

Wide gap semiconductors.

(1)

Wireless communication systems -- Equipment and supplies -- Design and construction.

(1)

Material Type

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1.

Cover image for Printed circuit board design techniques for EMC compliance a handbook for designers

Printed circuit board design techniques for EMC compliance a handbook for designers

Printed circuit board design techniques for EMC compliance a handbook for designers

Author

Montrose, Mark I. IEEE Electromagnetic Compatibility Society.

Preferred Shelf Number

ONLINE

Electronic Access

IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5264372

Format:

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2.

Cover image for Bridge engineering handbook

Bridge engineering handbook

Bridge engineering handbook

Author

Chen, Wai-Fah, 1936- Duan, Lian.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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3.

Cover image for Structural mechanics of buried pipes

Structural mechanics of buried pipes

Structural mechanics of buried pipes

Author

Watkins, Reynold King. Anderson, L. R. (Loren Runar), 1941-

Preferred Shelf Number

ONLINE

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4.

Cover image for Construction of marine and offshore structures

Construction of marine and offshore structures

Construction of marine and offshore structures

Author

Gerwick, Ben C.

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ONLINE

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5.

Cover image for Residential open building

Residential open building

Residential open building

Author

Kendall, Stephen. Teicher, Jonathan.

Preferred Shelf Number

ONLINE

Electronic Access

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6.

Cover image for Swimming pools

Author

Perkins, Philip Harold.

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ONLINE

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7.

Cover image for Analog BiCMOS design practices and pitfalls

Analog BiCMOS design practices and pitfalls

Analog BiCMOS design practices and pitfalls

Author

Daly, James C., 1938- Galipeau, Denis P.

Preferred Shelf Number

ONLINE

Electronic Access

book distributed by CRC Press. Purchase or institutional license may be required for access.

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8.

Cover image for Processing of high-temperature superconductors at high strain rates

Processing of high-temperature superconductors at high strain rates

Processing of high-temperature superconductors at high strain rates

Author

Mamalis, Athanasios G.

Preferred Shelf Number

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9.

Cover image for Non-linear static and cyclic analysis of steel frames with semi-rigid connections

Non-linear static and cyclic analysis of steel frames with semi-rigid connections

Non-linear static and cyclic analysis of steel frames with semi-rigid connections

Author

Chan, S. L. Chui, P. P. T.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780080429984

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10.

Cover image for The art of designing embedded systems

The art of designing embedded systems

The art of designing embedded systems

Author

Ganssle, Jack G.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780750698696

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11.

Cover image for Ionized physical vapor deposition

Ionized physical vapor deposition

Ionized physical vapor deposition

Author

Hopwood, Jeffrey A.

Preferred Shelf Number

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Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780125330275

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12.

Cover image for Computer simulated plant design for waste minimization/pollution prevention

Computer simulated plant design for waste minimization/pollution prevention

Computer simulated plant design for waste minimization/pollution prevention

Author

Bumble, Stan.

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