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1. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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2. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
Availability 
Beytepe Library~2
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3. 
Cover image for Ceramic interconnect technology handbook
Ceramic interconnect technology handbook
Author 
Barlow, Fred D. Elshabini, Aicha.
Preferred Shelf Number 
TK7871.15 .C4 C44 2007
Electronic Access 
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4. 
Cover image for Optical inspection of microsystems
Optical inspection of microsystems
Author 
Osten, Wolfgang.
Preferred Shelf Number 
TS156.2 .O652 2007
Electronic Access 
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