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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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2. 
Cover image for Nanotechnology for microelectronics and photonics
Nanotechnology for microelectronics and photonics
Author 
Martín-Palma, R. J. (Raúl J.), author. Martinez-Duart, J. M., author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780323461764
ScienceDirect https://www.sciencedirect.com/science/book/9780323461764
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3. 
Cover image for SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
Author 
Li, Suny, 1974- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
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4. 
Cover image for Harnessing bistable structural dynamics for vibration control, energy harvesting and sensing
Harnessing bistable structural dynamics for vibration control, energy harvesting and sensing
Author 
Harne, Ryan L., 1985- author. Wang, K. W., author.
Preferred Shelf Number 
TA355 .H345 2017 EB
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119128052
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5. 
Cover image for Real-time embedded systems
Real-time embedded systems
Author 
Wang, Jiacun, 1963- author.
Preferred Shelf Number 
TK7895 .E42
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119420712
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6. 
Cover image for Flexible glass : enabling thin, lightweight, and flexible electronics
Flexible glass : enabling thin, lightweight, and flexible electronics
Author 
Garner, Sean M., author.
Preferred Shelf Number 
TA418 .T45 F54 2017
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781118946404
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7. 
Cover image for From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428299
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8. 
Cover image for Ion exchange in environmental processes : fundamentals, applications and sustainable technology
Ion exchange in environmental processes : fundamentals, applications and sustainable technology
Author 
SenGupta, Arup K., author.
Preferred Shelf Number 
TP156 .I6
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119421252
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9. 
Cover image for From additive manufacturing to 3D/4D printing. 1, From concepts to achievements
From additive manufacturing to 3D/4D printing. 1, From concepts to achievements
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428510
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