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1. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-43199-4
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2. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-15407-7
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3. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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4. 
Cover image for Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors
Author 
Hwang, Cheol Seong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-8054-9
Format: 
Availability 
Online Library~1
Available:
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