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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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2. 
Cover image for Functional polyimide dielectrics : structure, properties, and applications
Functional polyimide dielectrics : structure, properties, and applications
Author 
Zha, Jun-Wei, editor.
Preferred Shelf Number 
TK7872 .D53 F86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527849031
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3. 
Cover image for Fuzzy systems modeling in environmental and health risk assessment
Fuzzy systems modeling in environmental and health risk assessment
Author 
Faybishenko, Boris, editor. Sadiq, Rehan, editor. Deshpande, Ashok, editor.
Preferred Shelf Number 
RA427.3 .F89 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119569503
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Availability 
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