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1. 
Cover image for Collaborative Product Design and Manufacturing Methodologies and Applications
Collaborative Product Design and Manufacturing Methodologies and Applications
Author 
Li, W. D. editor. McMahon, Chris. editor. Ong, S. K. editor. Nee, Andrew Y. C. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84628-802-9
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2. 
Cover image for Microfluidics Based Microsystems Fundamentals and Applications
Microfluidics Based Microsystems Fundamentals and Applications
Author 
Kakaç, S. editor. Kosoy, B. editor. Li, D. editor. Pramuanjaroenkij, A. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-9029-4
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3. 
Cover image for An Economic Analysis on Automated Construction Safety Internet of Things, Artificial Intelligence and 3D Printing
An Economic Analysis on Automated Construction Safety Internet of Things, Artificial Intelligence and 3D Printing
Author 
Li, Rita Yi Man. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-5771-7
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4. 
Cover image for 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
Author 
Li, Simon. author. Fu, Yue. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0481-1
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5. 
Cover image for Bioinspired materials science and engineering
Bioinspired materials science and engineering
Author 
Yang, Guang, 1968 April 18- editor. Xiao, Lin, 1986- editor. Lamboni, Lallepak, 1988- editor.
Preferred Shelf Number 
QP517 .B56
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119390350
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