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Microelectronic packaging.
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1. 
Cover image for Microelectronic packaging
Microelectronic packaging
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TK7870.15 .M53 2005
Electronic Access 
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2. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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3. 
Cover image for Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
Author 
Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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4. 
Cover image for Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Author 
Keser, Beth, 1971- editor. Kröhnert, Steffen, editor.
Preferred Shelf Number 
TK7870.15 .E43 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908
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5. 
Cover image for Antenna-in-package technology and applications
Antenna-in-package technology and applications
Author 
Liu, Duixian, editor. Zhang, Yueping, editor.
Preferred Shelf Number 
TK7871.67 .M5 A58 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119556671
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6. 
Cover image for Progress in adhesion and adhesives. Volume 4
Progress in adhesion and adhesives. Volume 4
Author 
Mittal, K. L., 1945- editor.
Preferred Shelf Number 
TP968
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119625322
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7. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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8. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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9. 
Cover image for Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures
Author 
Voyiadjis, George Z. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5589-9
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10. 
Cover image for Adhesion in microelectronics
Adhesion in microelectronics
Author 
Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.
Preferred Shelf Number 
ONLINE(341844.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373
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11. 
Cover image for Adhesion measurement of films and coatings. Volume 2
Adhesion measurement of films and coatings. Volume 2
Author 
Mittal, Kash L., 1945- editor. Taylor and Francis.
Preferred Shelf Number 
QC183
Electronic Access 
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12. 
Cover image for MEMS : fundamental technology and applications
MEMS : fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7875 .M457 2013
Electronic Access 
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