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1. 
Cover image for 3D integration of resistive switching memory
3D integration of resistive switching memory
Author 
Luo, Qing, 1988- editor.
Preferred Shelf Number 
TK7895 .M4 A14 2023
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003391586
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Semiconducting black phosphorus : from 2D nanomaterial to emerging 3D architecture
Semiconducting black phosphorus : from 2D nanomaterial to emerging 3D architecture
Author 
Zhang, Han (Semiconductor scientist), author. Abbasi, Nasir Mahmood, author. Wang, Bing (Semiconductor scientist), author.
Preferred Shelf Number 
TK7874.893
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003217145
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for Three-dimensional integrated circuit design
Three-dimensional integrated circuit design
Author 
Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780124105010
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4. 
Cover image for Design of 3D integrated circuits and systems
Design of 3D integrated circuits and systems
Author 
Sharma, Rohit, editor.
Preferred Shelf Number 
TK7874.893 .D48 2014
Electronic Access 
Click here to view.
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5. 
Cover image for Vertical 3D memory technologies
Vertical 3D memory technologies
Author 
Prince, Betty, author.
Preferred Shelf Number 
ONLINE(341730.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
John Wiley http://dx.doi.org/10.1002/9781118760475
Safari Books Online http://proquest.safaribooksonline.com/?fpi=9781118760468
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6. 
Cover image for Handbook of 3D Integration : 3D process technology
Handbook of 3D Integration : 3D process technology
Author 
Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.
Preferred Shelf Number 
ONLINE(342210.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527670109
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7. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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8. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
Format: 
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9. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
Preferred Shelf Number 
ONLINE
Electronic Access 
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10. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
Preferred Shelf Number 
ONLINE
Electronic Access 
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11. 
Cover image for Nano and molecular electronics handbook
Nano and molecular electronics handbook
Author 
Lyshevski, Sergey Edward.
Preferred Shelf Number 
TK7874.8 .N358 2007
Electronic Access 
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