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1. 
Cover image for Roloff/Matek Maschinenelemente Aufgabensammlung Aufgaben Lösungshinweise Ergebnisse
Roloff/Matek Maschinenelemente Aufgabensammlung Aufgaben Lösungshinweise Ergebnisse
Author 
Muhs, Dieter. author. Wittel, Herbert. author. Jannasch, Dieter. author. Voßiek, Joachim. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-8348-9229-4
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Cover image for Models for Computer Aided Tolerancing in Design and Manufacturing Selected Conference Papers from the 9th CIRP International Seminar on Computer-Aided Tolerancing, held at Arizona State University, Tempe, Arizona, USA, 10-12 April, 2005
Models for Computer Aided Tolerancing in Design and Manufacturing Selected Conference Papers from the 9th CIRP International Seminar on Computer-Aided Tolerancing, held at Arizona State University, Tempe, Arizona, USA, 10-12 April, 2005
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Davidson, Joseph K. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-5438-6
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Cover image for Computational Methods in Engineering & Science Proceedings of “Enhancement and Promotion of Computational Methods in Engineering and Science X” Aug. 21–23, 2006, Sanya, China
Computational Methods in Engineering & Science Proceedings of “Enhancement and Promotion of Computational Methods in Engineering and Science X” Aug. 21–23, 2006, Sanya, China
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Yao, Z. H. author. Yuan, M. W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-48260-4
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Cover image for Konstruieren mit Faser-Kunststoff-Verbunden
Konstruieren mit Faser-Kunststoff-Verbunden
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Schürmann, Helmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72190-1
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Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
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Greig, William J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-33913-2
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Cover image for Process Optimization A Statistical Approach
Process Optimization A Statistical Approach
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Castillo, Enrique Del. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-71435-6
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8. 
Cover image for Metal Fatigue What It Is, Why It Matters
Metal Fatigue What It Is, Why It Matters
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Pook, Les. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-5597-3
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9. 
Cover image for The Machines of Leonardo da Vinci and Franz Reuleaux Kinematics of Machines from the Renaissance to the 20th Century
The Machines of Leonardo da Vinci and Franz Reuleaux Kinematics of Machines from the Renaissance to the 20th Century
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Moon, Francis C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-5599-7
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10. 
Cover image for Micromanufacturing International Research and Development
Micromanufacturing International Research and Development
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Ehmann, Kornel F. author. Bourell, David. author. Culpepper, Martin L. author. Hodgson, Thom J. author. Kurfess, Thomas R. author.
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http://dx.doi.org/10.1007/978-1-4020-5949-0
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11. 
Cover image for Analog Design Centering and Sizing
Analog Design Centering and Sizing
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Graeb, Helmut E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6004-5
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12. 
Cover image for Distinguished Figures in Mechanism and Machine Science Their Contributions and Legacies Part 1
Distinguished Figures in Mechanism and Machine Science Their Contributions and Legacies Part 1
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Ceccarelli, Marco. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6366-4
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