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1. 
Cover image for Modeling and Simulation for RF System Design
Modeling and Simulation for RF System Design
Author 
Frevert, Ronny. author. Haase, Joachim. author. Jancke, Roland. author. Knöchel, Uwe. author. Schwarz, Peter. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-27585-1
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2. 
Cover image for Introduction to Advanced System-on-Chip Test Design and Optimization
Introduction to Advanced System-on-Chip Test Design and Optimization
Author 
Larsson, Erik. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b135763
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3. 
Cover image for Sensing Technology Proceedings of ICST'15
Sensing Technology Proceedings of ICST'15
Author 
Suryadevara, Nagender Kumar. editor. George, Boby. editor. Jayasundera, Krishanthi P. editor. Mukhopadhyay, Subhas Chandra. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29871-4
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4. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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5. 
Cover image for Nonlinear Optics Principles and Applications
Nonlinear Optics Principles and Applications
Author 
Li, Chunfei. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-1488-8
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6. 
Cover image for Neural Engineering From Advanced Biomaterials to 3D Fabrication Techniques
Neural Engineering From Advanced Biomaterials to 3D Fabrication Techniques
Author 
Zhang, Lijie Grace. editor. Kaplan, David L. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-31433-4
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7. 
Cover image for Lattices of Dielectric Resonators
Lattices of Dielectric Resonators
Author 
Trubin, Alexander. author. (orcid)0000-0001-5731-8018 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-25148-6
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8. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09111-2
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9. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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10. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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11. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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12. 
Cover image for Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich
Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich
Author 
Wiese, Steffen. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-05463-1
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