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13. 
Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK7870.15 .J36 2009
Electronic Access 
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14. 
Cover image for Package design workbook : the art and science of successful packaging
Package design workbook : the art and science of successful packaging
Author 
DuPuis, Steven. Silva, John.
Preferred Shelf Number 
NC1002.P33 D87 2008
Format: 
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15. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
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16. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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17. 
Cover image for Design of electromechanical products : an agile and systems approach
Design of electromechanical products : an agile and systems approach
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK2331
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003301523
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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18. 
Cover image for Green innovations for industrial development and business sustainability : models and implementation strategies
Green innovations for industrial development and business sustainability : models and implementation strategies
Author 
Sharma, Ravindra (Professor of management), editor. Rana, Geeta, editor. Agarwal, Shivani, editor.
Preferred Shelf Number 
HC79 .T4
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003458944
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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19. 
Cover image for EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
Author 
Atiqah, A.
Preferred Shelf Number 
TA418.9 .C6
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003408215
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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20. 
Cover image for Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Author 
Sun, Fuchun. editor. Cangelosi, Angelo. editor. Zhang, Jianwei. editor. Yu, Yuanlong. editor. Liu, Huaping. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0617-8
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21. 
Cover image for Progress in Sustainable Manufacturing
Progress in Sustainable Manufacturing
Author 
Kandasamy, Jayakrishna. editor. Sakthivel, Aravind Raj. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0201-9
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22. 
Cover image for Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 1
Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 1
Author 
Kabassi, Katerina. editor. Mylonas, Phivos. editor. Caro, Jaime. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-44097-7
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23. 
Cover image for Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Author 
Izquierdo, Luis R. editor. Santos, José Ignacio. editor. Lavios, Juan José. editor. Ahedo, Virginia. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29382-5
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24. 
Cover image for Handbook of Neuroengineering
Handbook of Neuroengineering
Author 
Thakor, Nitish V. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-16-5540-1
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