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1. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-72132-1
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2. 
Cover image for Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Author 
Wang, M. L., editor. Lynch, Jerome P. (Jerome Peter), editor. Sohn, H. (Hoon), editor.
Preferred Shelf Number 
ONLINE(355767.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781782422426
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3. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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4. 
Cover image for Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Author 
Zhu, Ren. author. Yang, Rusen. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-70038-0
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5. 
Cover image for Nanoscale Sensors
Nanoscale Sensors
Author 
Li, Shibin. editor. Wu, Jiang. editor. Wang, Zhiming M. editor. Jiang, Yadong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332946.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-02772-2
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6. 
Cover image for FIB Nanostructures
FIB Nanostructures
Author 
Wang, Zhiming M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332951.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-02874-3
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7. 
Cover image for Amorphous Nanophotonics
Amorphous Nanophotonics
Author 
Rockstuhl, Carsten. editor. Scharf, Toralf. editor. SpringerLink (Online service)
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ONLINE(333580.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-32475-8
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8. 
Cover image for Nanoimprint Lithography: An Enabling Process for Nanofabrication
Nanoimprint Lithography: An Enabling Process for Nanofabrication
Author 
Zhou, Weimin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333849.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34428-2
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9. 
Cover image for High Permittivity Gate Dielectric Materials
High Permittivity Gate Dielectric Materials
Author 
Kar, Samares. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334228.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36535-5
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10. 
Cover image for Physical Properties of Nanorods
Physical Properties of Nanorods
Author 
Krahne, Roman. author. Manna, Liberato. author. Morello, Giovanni. author. Figuerola, Albert. author. George, Chandramohan. author.
Preferred Shelf Number 
ONLINE(334202.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36430-3
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11. 
Cover image for Electromagnetic Behaviour of Metallic Wire Structures
Electromagnetic Behaviour of Metallic Wire Structures
Author 
Chui, S. T. author. Zhou, Lei. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330920.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4159-4
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12. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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